A dispensing system includes a frame, a support coupled to the frame, a dispensing unit configured to dispense viscous material, and a gantry assembly coupled to the frame. The gantry assembly includes a gantry configured to support the dispensing unit and to move the dispensing unit in x-axis, y-axis and z-axis directions and a tilt and rotate subassembly configured to tilt and rotate the dispensing unit. The dispensing system further includes a controller configured to control dispensing unit and the gantry assembly to perform a dispense operation on the electronic substrate. The controller is configured to simultaneously coordinate the movement of the gantry assembly and the tilt and rotate subassembly to position and orient the nozzle of the dispensing unit a predetermined distance and orientation from the electronic substrate while dispensing material along a three-dimensional path.

The present invention comprises an apparatus for manufacturing electronics without PCBs.

A method for modifying an elongate structure including providing a fluid deposited onto the substrate, the fluid containing a dispersion of electrically polarizable nanoparticles and applying an AC voltage across a portion of the elongate structure so as to cause an alternating electric current to pass through the narrow section such that a break in the elongate structure is formed at the narrow section, the break being defined between a first broken end and a second broken end of the elongate structure, and then cause, when the break is formed, an alternating electric field to be applied to the fluid such that a plurality of the nanoparticles contained in the fluid are assembled to form a continuation of the elongate structure extending from the first broken end towards the second broken end so as to join the first and second broken ends.

Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.

A dispensing system includes a frame, a support, a dispensing unit assembly, and a gantry. The gantry is configured to support the dispensing unit assembly and to move the dispensing unit assembly in x-axis and y-axis directions. The dispensing unit assembly includes a support bracket secured to the gantry and a movable bracket rotatably coupled to the support bracket configured to enable the rotation of the movable bracket with respect to the support bracket about a first axis, with a dispensing unit rotatably coupled to the movable bracket configured to enable the rotation of the dispensing unit with respect to the movable bracket about a second axis generally perpendicular to the first axis. A mass dampener assembly is coupled to the movable bracket, with the mass dampener assembly being configured to reduce vibration of the dispensing unit during operation.

An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system and method may include an underfill chamber having an input through which the printed circuit board is received; at least one dispensing robot capable of dispensing the underfill to the components; a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; and an overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.

Systems and methods for bonding an electronic component to substrate with a rough surface. The method comprising: disposing an insulating adhesive on the substrate; applying heat and pressure to the insulating adhesive to cause the adhesive to flow into at least one opening formed in the substrate; curing the insulating adhesive to form a pad that is at least partially embedded in the substrate and comprises a planar smooth surface that is exposed; disposing at least one trace on the planar smooth surface of the pad; depositing an anisotropic conductive material on the pad so as to at least cover the at least one trace; placing the electronic component on the pad so that an electrical coupling is formed between the electronic component and the at least one trace; and bonding the electronic component to the substrate by curing the anisotropic conductive material.

A method for producing a ceramic circuit board including a ceramic substrate and a metal circuit formed on the ceramic substrate. The disclosed method includes a step of forming the first metal layer in contact with the ceramic substrate by spraying a first metal powder containing at least either of aluminum particles or aluminum alloy particles together with an inert gas onto a surface of a ceramic substrate from a nozzle, in which the first metal powder is heated to from 10° C. to 270° C. and then ejected from the nozzle 10 and a gauge pressure of the inert gas at an inlet of the nozzle 10 is from 1.5 to 5.0 MPa, a step of subjecting the first metal layer to a heat treatment in an inert gas atmosphere, and the like.

A dispensing system includes a dispensing unit assembly configured to dispense viscous material and a gantry coupled to the frame. The gantry is configured to support the dispensing unit assembly and to move the dispensing unit assembly in x-axis and y-axis directions. The dispensing unit assembly includes a support bracket secured to the gantry and a movable bracket rotatably coupled to the support bracket by a first strain wave gear system configured to enable the rotation of the movable bracket with respect to the support bracket about a first axis. The dispensing unit assembly further includes a dispensing unit rotatably coupled to the movable bracket by a second strain wave gear system configured to enable the rotation of the dispensing unit with respect to the movable bracket about a second axis generally perpendicular to the first axis.

A lighting unit for a vehicle has a light source carrier with an arrangement of data lines. The lighting unit also has a plurality of light sources positioned on the light source carrier, each of which has an integrated control unit and which are interconnected via the arrangement of data lines in order to exchange data according to a predefined protocol. The rear face of the light source carrier has a plurality of cavities. The front face of the light source carrier is light-conductive, at least in the region of the cavities. The arrangement of data lines is on the rear face of the light source carrier and the line ends of the data lines lead up to or into the number of cavities. At least one light source is fitted into each of the plurality of cavities, such that each light emission surface is oriented towards the floor of the cavity and the light source is electrically contacted and held in the cavity by electrical and mechanical contact with the line ends of the data lines.