The present disclosure includes a method for producing a printed circuit board having at least one coating includes mixing a first component with a second component of a two component coating system to form a coating mixture by means of a dynamic mixer or by means of a static-dynamic mixer. The method also includes supplying the coating mixture to an output unit, and coating the printed circuit board by outputting the coating mixture using the output unit onto the printed circuit board. The output unit is moved automatically in at least one, two, or three dimensions relative to the printed circuit board. The mixer is connected with the output unit in such a manner that it is moved together with the output unit relative to the printed circuit board. The present disclosure also includes a coating head for performing the method.

Systems and methods for enhanced coating dispensing controls are disclosed. A dispensing system is configured to apply material to a sequence of substrates. The dispensing system applies a first amount of material to a first substrate according to a first value of an operating parameter. A sensor is used to measure a characteristic of the first amount of material applied on the first substrate. Based on the characteristic of the first amount of material applied on the first substrate, a characteristic of an amount of material, after being applied on a subsequent substrate in the sequence of substrates, is estimated to be outside of a range. The value of the operating parameter is adjusted in response and a second amount of material is applied to a second substrate.

A system and method for applying a coating to a substrate are disclosed. The system includes a coating station for applying a coating material to the substrate, where the coating station has a bottom portion, an oven for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion, and a first lift for transporting the substrate from the coating station to the oven. The system can also include an inspection station for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.

A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.

A method for repairing a fine line is provided. Nano metal particles are filled in a defect of a circuit board. The nano metal particles in the defect are irradiated by a laser, or heated, such that the nano metal particles in the defect are metallurgically bonded to an original line of the circuit board. A surface of the circuit board is cleaned to remove residual nano metal particles on parts of the circuit board where metallurgical bonding is not performed, thereby completing line repairing of the circuit board.

Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.

A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.

Provided is a device configured to manufacture a conductive film including a rotating member, a first syringe, and a second syringe. The rotating member rotates about an axis extending in a first direction. The first syringe is disposed over a first portion of the rotating member, and is configured to discharge a first polymer and conductive balls. The second syringe is adjacent to the first syringe, and is configured to discharge a second polymer.

A system and corresponding method for additive manufacturing of a three-dimensional (3D) object to improve packing density of a powder bed used in the manufacturing process. The system and corresponding method enable higher density packing of the powder. Such higher density packing leads to better mechanical interlocking of particles, leading to lower sintering temperatures and reduced deformation of the 3D object during sintering. An embodiment of the system comprises means for adjusting a volume of a powder metered onto a top surface of the powder bed to produce an adjusted metered volume and means for spreading the adjusted metered volume to produce a smooth volume for forming a smooth layer of the powder with controlled packing density across the top surface of the powder bed. The controlled packing density enables uniform shrinkage, without warping, of the 3D object during sintering to produce higher quality 3D printed objects.

A dispensing system includes an optional pre-heat station configured to receive an electronic substrate, a dispense station configured to dispense material on the electronic substrate received from the optional pre-heat station, an optional post-heat station configured to receive the electronic substrate from the dispense station, and a non-contact sensor positioned above the electronic substrate on at least one of the optional pre-heat station, the dispense station, and the optional post-heat station.