Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.

An electronic device including an electromagnetic shielding structure is provided. The electronic device includes a printed circuit board, an antenna module, and an electromagnetic wave shielding structure. The antenna module includes a radio frequency integrated circuit mounted on the printed circuit board, and an array antenna coupled to an upper portion of the radio frequency integrated circuit. The electromagnetic wave shielding structure surrounds a side portion of the antenna module.

The present disclosure provides a curved surface coating device. The curved surface coating device includes a bracket having a first and second ends. The curved surface coating device includes a glue coating portion connected with the first end of the bracket. The curved surface coating device includes a transmission member connected between the first and second ends of the bracket and its distance from the first end of the bracket is adjustable. The curved surface coating device includes a first driving mechanism connected with the transmission member for driving the bracket through the transmission member to rotate around the transmission member as a center of rotation. The curved surface coating device includes a second driving mechanism connected with the bracket for driving the bracket to move on a line where the first end and the second end are located.

A method of using a hand-made circuit board for learning includes: providing a hand-made circuit board which comprises a substrate; and a medium layer disposed on a surface of the substrate to form a pattern, wherein the medium layer has a notably paintable non-conductive zone configured with a plurality of electrical blocks, and the electrical blocks are discontinuously distributed in the notably paintable non-conductive zone, so that the electrical blocks on at least one cross-section of the notably paintable non-conductive zone are not electrically connected; and drawing a drawn conductive layer on the notably paintable non-conductive zone of the pattern by an end user, wherein the drawn conductive layer has conductive particles linking the electrical particle blocks in the notably paintable non-conductive zone, thereby electrically connecting the electrical particle blocks to complete a circuit line.

A method of manufacturing a circuit substrate including forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method including filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including SnBi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further including performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.

A stencil printer includes a frame, a stencil coupled to the frame, the stencil having apertures formed therein, a support assembly coupled to the frame, the support assembly including tooling configured to support the electronic substrate in a print position beneath the stencil, a print head assembly coupled to the frame in such a manner that the print head assembly is configured to traverse the stencil during print strokes, the print head assembly including a squeegee blade assembly and at least one paste cartridge to deposit solder paste on the stencil, and a robotic arm configured to perform functions within the stencil printer.

A delivery device is configured to deliver changeover and/or replacement items within a stencil printer. The delivery device includes a housing configured to support replacement and/or replenishment items, the housing having wheels or casters to enable the housing to roll along a relatively flat surface, at least one support structure configured to store items for the stencil printer, and one or more device configured to transport items from the delivery device to the stencil printer and from the stencil printer to the delivery device.

A system or method of fully automating a changeover and/or a replacement process within a stencil printer includes a stencil printer having at least one item scheduled for replacement within the stencil printer, a stockroom configured to store a plurality of items, and a delivery device. The delivery device is configured to transport an item of the plurality of items to the stencil printer, remove a used item scheduled for replacement, install the item of the plurality of items on the stencil printer, transport the used item to a station configured to inspect and perform one or more functions on the used item to render the used item ready for use, and transport the used item to the stockroom for future use within the stencil printer.

A method for producing a printed circuit board on a substrate uses control data derived from a circuit schematic, CAD file, Gerber file or files or equivalents, to operates a function head configured to effect printing conductive and non-conductive materials on the substrate and produces control data to effect the circuit printing. The method optionally uses a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.

A printed circuit board (PCB) printing method includes obtaining PCB parameters and stencil printing parameters of a PCB to be printed, determining print parameters for printing the PCB according to a print model parameter relationship, the obtained PCB parameters, and standard values of solder paste detection parameters, transmitting the determined print parameters to a printer for printing the PCB, receiving values of the solder paste detection parameters detected by a solder paste inspection device, determining whether the detected values are within a preset range of the standard values, and re-determining the print parameters when the detected values are not within the preset range of the standard values. The print model parameter relationship indicates a relationship of the PCB parameters and the print parameters to solder paste detection parameters. The solder paste detection parameters include information related to solder paste on the printed PCB.