H05K2203/013

SYSTEM AND METHOD FOR JETTING DISPENSER POSITIONAL CONTROL
20210245188 · 2021-08-12 ·

Systems and methods of controlling movement of a moving part of an applicator for jetting material from the applicator are disclosed. The method includes actuating a piezoelectric device operatively connected to a needle by providing a voltage waveform to the piezoelectric device, such that the needle translates along a positional path in a first dispensing operation. The method also includes sensing positions of the moving part over a period of time, where the positions define a time-dependent positional profile of the moving part, and receiving parameters for a second dispensing operation. The method also includes determining a required voltage waveform to be applied to the piezoelectric device to perform the second dispensing operation, and adjusting the voltage waveform provided to the piezoelectric device to match the required positional profile.

ULTRA THIN DIELECTRIC PRINTED CIRCUIT BOARDS WITH THIN LAMINATES AND METHOD OF MANUFACTURING THEREOF
20210243903 · 2021-08-05 ·

Ultra-thin dielectric printed circuit boards (PCBs) are provided. An ultra-thin dielectric layer may be coupled to a first conductive layer on a first side of the ultra-thin dielectric layer. A second conductive layer may be coupled to a second side of the ultra-thin dielectric layer, and the ultra-thin dielectric layer is thinner than at least one of the first conductive layer and the second conductive layer. The second conductive layer may be patterned to form electrical paths. The patterned second conductive layer may be filled with a dielectric filler. One or more conductive layers and one or more ultra-thin dielectric layers may also be coupled to the second conductive layer.

DIRECT INKJET PRINTING OF INFRASTRUCTURE FOR INTEGRATED CIRCUITS
20210243904 · 2021-08-05 ·

The disclosure relates to methods for direct ink jet printing of printed circuits' infrastructure. Specifically, the disclosure relates to methods for direct inkjet printing of heatdissipation elements and sockets for use in printed circuit boards (PCBs), flexible printed circuits (FPCs) and high-density interconnect (HDI) printed circuits.

Inkjet printer with substrate height position control

An inkjet printer is described. The inkjet printer has a substrate holder assembly that includes a base member having a long axis in a first direction and a short axis in a second direction perpendicular to the first direction; a contact member coupled to the base member, the contact member having a long axis in the first direction and a short axis in the second direction; a holder carriage coupled to the base member; a linear extender coupled between the base member and the contact member and extending in a third direction intersecting with the first direction and the second direction from the base member toward the contact member; and a flex member coupled to the base member, extending in the second direction between the linear extender and the contact member, and having a flex direction in a direction perpendicular to the first direction and the second direction.

Flexible conductive printed circuits with printed overcoats

A method for producing flexible conductive printed circuit with a printed overcoat is disclosed. For example, the method includes forming conductive printed circuit lines on a flexible substrate, detecting locations on the flexible substrate where the conductive printed circuit lines are formed, and printing an overcoat over the conductive printed circuit lines at the locations that are detected on the flexible substrate, wherein the overcoat comprises a mixture of thermoplastic polyurethane (TPU) and a solvent having a viscosity of 1 centipoise to 2,000 centipoise to allow the mixture to be printed.

Double-sided and multilayered printed circuit board fabrication using inkjet printing

The disclosure relates to methods, kits and compositions for direct printing of double-sided and/or multilayered printed circuit boards. Specifically, the disclosure relates to the printing of conductive leads and insulating portions of printed circuit boards using inkjet printing.

LIQUID AGENT SUPPLY DEVICE AND LIQUID AGENT SUPPLY METHOD
20210260680 · 2021-08-26 ·

A liquid agent supply device includes: a holder that holds a board; a supply head including a plurality of nozzles for supplying a liquid agent to a plurality of supply positions on the board held by the holder are arranged; and a supply head mover that relatively moves the board and the supply head, wherein the supply head mover relatively moves the board and the supply head according to a first movement method in which the board and the supply head relatively move along a specific direction determined regardless of supply positions among the plurality of supply positions, in a supply range including the plurality of supply positions.

METHOD FOR REPAIRING A FINE LINE
20210176865 · 2021-06-10 ·

A method for repairing a fine line is provided. Nano metal particles are filled in a defect of a circuit board. The nano metal particles in the defect are irradiated by a laser, or heated, such that the nano metal particles in the defect are metallurgically bonded to an original line of the circuit board. A surface of the circuit board is cleaned to remove residual nano metal particles on parts of the circuit board where metallurgical bonding is not performed, thereby completing line repairing of the circuit board.

Additive manufacturing techniques for meander-line polarizers

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for producing meander-line polarizers. In some implementations, a meander-line polarizer includes a dielectric substrate made of a polyester polymer material and meander-line arrays formed on a surface of the dielectric substrate. Each meander-line array includes a sequence of alternating perpendicular conductive traces that are formed the surface of the dielectric substrate by applying conductive ink to the surface of the dielectric substrate using a template that defines a location and dimensions of each conductive trace of each meander-line array.

FLEXIBLE CONDUCTIVE PRINTED CIRCUITS WITH PRINTED OVERCOATS
20210195759 · 2021-06-24 ·

A method for producing flexible conductive printed circuit with a printed overcoat is disclosed. For example, the method includes forming conductive printed circuit lines on a flexible substrate, detecting locations on the flexible substrate where the conductive printed circuit lines are formed, and printing an overcoat over the conductive printed circuit lines at the locations that are detected on the flexible substrate, wherein the overcoat comprises a mixture of thermoplastic polyurethane (TPU) and a solvent having a viscosity of 1 centipoise to 2,000 centipoise to allow the mixture to be printed.