A method is disclosed for applying an electrical conductor to an electrically insulating substrate, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded to the grooves adheres to the substrate. The membrane(s) and the substrate are separated and the composition in the groove is left on the surface of the electrically insulating substrate. The electrically conductive particles in the composition are then sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).

A method of manufacturing a solid freeform fabrication object includes forming a fabrication layer containing a solid freeform fabrication material containing a powder material, a binder material, and a solvent, forming a void in the fabrication layer in a ratio of the void of 20 percent by volume or more in the fabrication layer, curing a predetermined region in the fabrication layer by applying a curing liquid to the predetermined region to form a cured layer, and repeating laminating the cured layer.

A method of manufacturing a circuit substrate including forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method including filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including SnBi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further including performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.

A solder paste printer for which a pressing force of squeegee 62 towards a stencil when spreading solder paste 110, that is, a printing pressure, is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.

A method of manufacturing a flexible electronic circuit is provided. The method may include forming a positive photoresist mold on a flexible polymer substrate having a plurality of metal traces. The method may also include applying a conformal material coating over the positive photoresist mold, the flexible polymer substrate, and the metal traces. The method may further include removing an excess of the conformal material coating by running a blade over the positive photoresist mold. The method may also include removing the positive photoresist mold to reveal a cavity defined by the conformal material coating. The method may further include dispensing an anisotropic conductive paste into the cavity and inserting a chip into the cavity and bonding the chip to the metal traces.

A mass produced electrically conductive device with sufficiently high yield, even when forming a conductive layer pattern having an extremely small thickness/minimum area using a minimum amount of silver paste. The identifier-providing device has a conductive layer pattern formed on a rear surface of a base material as an insulator. The silver paste forming the conductive layer pattern contains only silver flakes, as silver particles, that have a particle size in a range of 3.0 to 5.0 m and that has a thickness of 100 nm at a largest thickness portion, while having a thickness of 50 nm at a smallest thickness portion. The conductive layer pattern is formed to have a film thickness of 10 m or less by laminating the silver flakes in the thickness direction. The silver flakes forming the conductive layer are in a fused state or an aggregating/cohering state at the smallest thickness portion.

In a method for filling through-holes of a substrate with a metal paste, an upper lamination foil is secured to the top surface of the substrate and a lower lamination foil is secured to the bottom surface of the substrate. A laser beam is used to generate a first plurality of holes in the upper lamination foil, and a second plurality of holes in the lower lamination foil. Respective locations of the first and second plurality of holes are aligned with the through-holes of the substrate. Metal paste is applied into the through-holes through the first plurality of holes using a squeegee or a knife. Any metal paste that is pressed out from the second plurality of holes may be scraped off by the squeegee or the knife and recycled. Finally, the upper and lower lamination foils may be removed from the substrate.

A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.

A solder recovery device includes a recovery plate, a lifting and lowering device, and multiple connecting sections. The recovery plate recovers solder. The lifting and lowering device lifts up and lowers the recovery plate. The multiple connecting sections include a fixing portion provided on the recovery plate and configured to detachably attach the recovery plate to the lifting and lowering device and a fixed portion provided on the lifting and lowering device and to which the fixing portion is fixed, and are configured to restrain the recovery plate from moving in a predetermined direction relative to the lifting and lowering device when the fixing portion is fixed to the fixed portion. The multiple connecting sections have different restraining directions in which the recovery plate is restrained from moving relative to the lifting and lowering device.

The invention relates to a printing device for applying a viscous or pasty material onto a support substrate and molding a defined material geometry by means of a template. The template which is provided for application and molding purposes has at least one continuous opening, and the opening side facing the support substrate functions as an application opening surface. Furthermore, the opening, in particular the inner wall thereof, forms an outer border for the material geometry outer surface to be molded. As a whole, the template is designed such that an adhesive force of the viscous or pasty material acting on the inner wall of the opening is overcome by means of a relative movement, in particular a movement relative to the support substrate. The template is advantageously formed as a stack composite of at least two sub-templates adjoining each other in a connection region. Each of the sub-templates has at least one sub-opening, by means of which the inner wall of the opening is divided into proportional molding surfaces of the sub-template. Furthermore, sub-opening connection surfaces which correspond to one another are formed in the connection region, and each of the sub-templates can be reversibly separated in the connection region.