Disclosed is a circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness. The circuit pattern continuous manufacturing device may include: an unwinder configured to unwind a transfer film to be horizontally unfolded; a rotary drum-type continuous electroforming part configured to form a circuit pattern having a first metal layer on the surface of a rotating cathode drum through electroforming; a continuous transfer part configured to transfer the circuit pattern, formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part, onto the transfer film; a first horizontal plating path configured to additionally plate the circuit pattern, transferred onto the transfer film, with a second metal layer made of the same metal as the rotary drum-type continuous electroforming part; and a rewinder configured to rewind the transfer film.

A resist layer forming method includes a process of laminating a resist layer on a base at a first pressure using a laminate roller having a first temperature, and a process of pressing the resist layer against the base at a second pressure higher than the first pressure using a metal plate having a second temperature lower than the first temperature.

A manufacturing method of tape includes the steps of providing a tape including substrate units, providing a die device and a cutting and/or pressing process. Each of the substrate units includes a carrier, a circuit layer, an adhesive and a heat spreader, the heat spreader is attached onto the carrier by the adhesive. In the cutting and/or pressing process, the die device is provided to press the tape to generate separation protrusions on the heat spreader and allow the separation protrusions to protrude from a heat dissipation surface of the heat spreader. When rolling the tape, the separation protrusions can separate the stacked substrate units to prevent the adhesive from being squeezed out to contaminate the tape.

A smart functional leather assembly includes a leather substrate, an electronic circuit layer including one or more conductive traces and optional electronic elements arranged on the leather substrate, optionally a pigmented coating arranged on the circuit layer, and an optional anti-soiling layer arranged on the pigmented layer. The entire smart functional leather assembly, including the circuit, are embossed to provide an embossed smart functional leather assembly with an embossed pattern.

A sensing decal (400) for use in the production of a sensor, includes a flexible release layer (401), a conductive ink layer (402) and an adhesive layer (403). The conductive ink layer is printed onto a first surface (404) of the flexible release layer and the adhesive layer is printed onto the conductive ink layer. The first surface includes a substantially non-uniform surface (405) and the conductive ink layer includes at least one patterned element (503-509) providing a predetermined set of electrical properties for formation of a sensor.

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.

A sensing decal (400) for use in the production of a sensor, includes a flexible release layer (401), a conductive ink layer (402) and an adhesive layer (403). The conductive ink layer is printed onto a first surface (404) of the flexible release layer and the adhesive layer is printed onto the conductive ink layer. The first surface includes a substantially non-uniform surface (405) and the conductive ink layer includes at least one patterned element (503-509) providing a predetermined set of electrical properties for formation of a sensor.

The present invention refers to a new type of transport roller providing a modified surface to provide improved transport properties for new substrates. Furthermore, it refers to horizontal transport systems beneficially utilizing such transport rollers, especially for providing retaining roller pairs. Additionally, the present invention refers to a treatment device containing such transport roller or horizontal transport system. Furthermore, it refers to a method for treating a substrate and the use of such transport roller.

A smart functional leather assembly includes a leather substrate, an electronic circuit layer including one or more conductive traces and optional electronic elements arranged on the leather substrate, optionally a pigmented coating arranged on the circuit layer, and an optional anti-soiling layer arranged on the pigmented layer. The entire smart functional leather assembly, including the circuit, are embossed to provide an embossed smart functional leather assembly with an embossed pattern.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.