A system and corresponding method for additive manufacturing of a three-dimensional (3D) object to improve packing density of a powder bed used in the manufacturing process. The system and corresponding method enable higher density packing of the powder. Such higher density packing leads to better mechanical interlocking of particles, leading to lower sintering temperatures and reduced deformation of the 3D object during sintering. An embodiment of the system comprises means for adjusting a volume of a powder metered onto a top surface of the powder bed to produce an adjusted metered volume and means for spreading the adjusted metered volume to produce a smooth volume for forming a smooth layer of the powder with controlled packing density across the top surface of the powder bed. The controlled packing density enables uniform shrinkage, without warping, of the 3D object during sintering to produce higher quality 3D printed objects.

System and method of producing on-demand three-dimensional (3D) printed devices on flexible substrates such as paper, plastic, or polymer using metal alloy nanopowders at low temperatures of printing in the range of 150 degrees Celsius (C) to 300 degrees C. The printer disclosed herein may employ a computer-aided design graphics file given as an input to the printer. The printer will selectively release and print the metal alloy nanopowders on select areas on the substrate to form a conductive pattern.

A laminate that includes a metal layer that is not easily separated from a substrate, a method for producing the laminate, and a method for forming a fine conductive pattern that exhibits high conductivity, are disclosed. The peel strength of a metal layer included in a laminate that includes a polymer layer provided between a substrate and the metal layer is improved by implementing a structure in which the metal that forms the metal layer is chemically bonded to COO that extends from the polymer main chain that forms the polymer layer at the interface between the metal layer and the polymer layer. A fine conductive pattern that exhibits high conductivity can be formed by applying UV light to a pattern area of an insulating film formed on a substrate, and applying an ink prepared by dispersing metal nanoparticles in a solvent to the substrate to effect adhesion and aggregation of the ink in the pattern area, the surface of the metal nanoparticles being protected by an organic molecule layer.

The present disclosure relates to a multilayer circuit board manufacturing apparatus. The present disclosure includes: uncoiler configured to provide a member; a process unit configured to perform a process on the member provided from the uncoiler; a recoiler configured to wind the member on which the process is completed in the process unit; and a tension adjustment unit which is located in at least one of the uncoiler, the recoiler, a region between the uncoiler and the process unit, and a region between the process unit and the recoiler, and adjusts tension of the member.

A smart functional leather assembly includes a leather substrate, an electronic circuit layer including one or more conductive traces and optional electronic elements arranged on the leather substrate, optionally a pigmented coating arranged on the circuit layer, and an optional anti-soiling layer arranged on the pigmented layer. The entire smart functional leather assembly, including the circuit, are embossed to provide an embossed smart functional leather assembly with an embossed pattern.

A method of forming a multi-layered printed circuit board (PCB) may include, with a printing device, delivering a flexible medium to at least one fluid jet printhead. Printing an electrically conductive fluid on the flexible medium may be performed with at least one fluid jet printhead, to form a first conductive layer on the flexible medium. With the at least one fluid jet printhead, an electrically insulating fluid may be printed on the first conductive layer to form at least one insulating layer on the first conductive layer. With the at least one fluid jet printhead, the electrically conductive fluid may be printed on the at least one insulating layer to form a second conductive layer.

A method for forming support structures for electrically-powered lighting devices, the method comprising: providing an electrically insulating ribbon-like substrate, forming electrically-conductive lines on a surface of the substrate by screen printing of electrically-conductive ink, the screen printing comprising printing a plurality of repeated printed images, which follow one another along a longitudinal direction and are separated from each other by separation gaps, and forming electrically-conductive ink jumpers that extend through the separation gaps and which provide electrical continuity between electrically-conductive lines of adjacent printed images, wherein forming ink jumpers comprises delivering electrically-conductive ink by inkjet printing.

Provided is a method for producing a metal-clad laminate of a thermoplastic liquid crystal polymer film (TLCP film) and a metal sheet(s) bonded to at least one surface of the film using roll-to-roll processing. The metal sheet has a surface with a ten-point average roughness (Rz) of 5.0 m or less to be bonded to the TLCP film. The method includes preparing the laminate, dry-treating the laminate by subjecting the laminate passed through a dry zone satisfying the following conditions (1) and (2): (1) a drying temperature of lower than the melting point of the TLCP film, (2) for a drying period of 10 seconds or longer, and heat-treating the dried laminate by subjecting the laminate passed through a heating zone on a temperature condition of not lower than the melting point of the TLCP film successively after the dry treatment.

Disclosed is an apparatus and method for a magnetic component. The method of an example embodiment includes: forming a feature on a substrate, the feature being a depression defining an inside surface; disposing a first conductive pattern on the substrate and the inside surface of the feature; disposing a permeability material on the inside surface of the feature and the first conductive pattern; disposing a substrate material on the substrate and the feature; disposing a second conductive pattern on the substrate material, the second conductive pattern substantially matching the first conductive pattern to wrap the permeability material between the first conductive pattern and the second conductive pattern producing a winding type structure electrically coupling the first conductive pattern and the second conductive pattern in electrical connection to define at least one electrical circuit to facilitate a magnetic field in the permeability material; and gapping the permeability material to remove at least a portion of the permeability material to produce a gap in the at least a portion of the permeability material.

A roller structure and method of using the same are introduced. The roller structure includes a first sleeve having a mounting portion for mounting a roller portion and a first connection portion for mounting a carried object, wherein the roller portion is disposed at the mounting portion; and a positioning element disposed at the first sleeve and the roller portion to cause the roller portion to rotate relative to the mounting portion. The roller structure can be conveniently and quickly amounted on the carried object, roller frame or circuit board such that roller structure gets standardized and modularized to serve an industrial purpose and provides rollers rotatable in all directions and suitable for use in SMT (Surface Mount Technology) processes and automated assembly operation.