A method of manufacturing printed circuit boards includes some or all of: chemically or electrically applying metallic layers to a substrate; incorporating bores into the substrate; through-contacting the bores incorporated into the substrate; applying a layer from a photoresist to an electrically conducting layer in a masking step; exposing the photoresist while using an exposure mask in an exposing step; removing exposed or unexposed regions of the layer from the photoresist while in regions laying bare the electrically conducting layer in a developing step; removing the laid-bare regions of the electrically conducting layer in an etching step; cleaning the substrate in a rinsing step; and drying the substrate, wherein the substrate for carrying out the developing step and/or the etching step is set in rotation and a developer solution and/or an etching liquid is applied to the rotating substrate by at least one nozzle.

A conveyor system for a stencil printer includes a pair of rail members, with the pair of rail members extending through a frame and configured to transport the substrate through the stencil printer. The conveyor system further includes, for each rail member, a lift tool assembly coupled to the rail member. The lift tool assembly includes a lifter portion, a main plate secured to the lifter portion, and a clamping member coupled to the main plate. The clamping member is configured to move horizontally between a substrate engaged position and a substrate disengaged position. The lift tool assembly further includes a thin foil coupled to the main plate. The thin foil is configured to move vertically and horizontally, independent from the clamping member.

A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.

Embodiments herein describe a capillary containing a eutectic conductive liquid (e.g., EGaIn) and an electrolyte (e.g., NaOH) that is integrated into a printed circuit board (PCB). In one embodiment, the capillary is formed in a through-hole in the PCB and has negative and positive electrodes at its respective ends to seal the eutectic conductive liquid and the electrolyte. The capillary further includes one or more electrodes that extend through a side of the portion of the capillary containing the liquids. The wiper electrodes also make electrical contact with respective conductive layers in the PCB. Using a DC voltage between the negative and positive electrodes, the eutectic conductive liquid forms electrical connections between the wiper electrodes, which in turn, forms electrical connections between the conductive layers in the PCB.

A wet type processing apparatus includes a processing bath for reserving inside the processing liquid and rendering the resin film pass through the processing liquid; a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a circumferential surface having plural holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the holes.

A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.

A welding system comprises a welding module and a moving module adapted to move the welding module to a predetermined welding position. The welding module includes a guiding device and a welding tool. The guiding device has a plurality of tubular guiding heads arranged in a row, ends of the plurality of tubular guiding heads are disposed close to joints of a plurality of cables so as to guide a plurality of welding wires to the joints of the plurality of cables. The welding tool has a plurality of tooth-shaped welding heads arranged in a row, ends of the plurality of tooth-shaped welding heads are disposed close to the joints of the plurality of cables and configured to simultaneously heat the plurality of welding wires guided to the joints of the plurality of cables, so as to simultaneously weld the joints of the plurality of cables onto a circuit board.