A substrate cover has a conductive frame body covering a surface circumference edge region and an upper circumference region of a substrate drawn with a charged particle beam, the conductive frame body comprising a notch portion provided at part of an inner circumference of the conductive frame body, and a recessed portion provided on the outer circumference side of the upper surface of the conductive frame body, such that the recessed portion is arranged adjacent to the notch portion in a direction of a frame width of the conductive frame body, and a conductive member provided on the recessed portion so as to pass through the notch portion to project inward to the inside of the frame of the conductive frame body, the conductive member comprising a contact portion electrically connected to the surface of the substrate, and a brim portion covering an upper portion of a gap.

Methods and apparatus for providing conformal shielding are disclosed to provide electromagnetic interference shielding of circuit components mounted on a circuit board. A print mold stencil is provided with one or more conductive shielding walls disposed within the stencil before its application to the circuit board and detachable therefrom, and also configured to encompass the circuit components. In this manner a shielded compartment volume is defined by walls of the print mold stencil and one or more of the conductive shielding walls, and may be easily and quickly applied to the circuit board to encompass the components for shielding. A conformal shielding layer is then formed from a molding material disposed in the shielded compartment volume that encompasses the components, as well as a conductive layer disposed on the outer surface of the material, and coupling of the shielding walls with a ground plane in the circuit board.

Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening portions in the metal frame have side walls having holding portions such that the holding portions hold the wiring boards in the opening portions in the metal frame, and the metal frame has slit portions adjacent to the holding portions and connecting portions connecting the slit portions to the opening portions.

A suspension board with circuit assembly sheet includes an assembly provided region provided with a plurality of suspension boards with circuits at spaced intervals to each other along one direction and a margin region provided at least at one side in a crossing direction with respect to the one direction of the assembly provided region. In the assembly provided region, a first opening portion is provided between the suspension boards with circuits that are adjacent to each other and in the margin region, a fragile portion is provided.

An apparatus configured to temporarily support a Ball Grid Array (BGA) component against a printed circuit board (PCB) during a manufacturing reflow operation, the apparatus including a support plate sized to fit over the BGA and having one or more mounting holes external to the periphery of the Ball Grid Array component, a retaining member for each mounting hole, passing through said mounting hole, a resilient biasing member for each retaining member, wherein the resilient biasing member urges the support plate against the BGA component from below the BGA component such that the BGA component is urged against the PCB.

A mask frame assembly includes: a mask including a deposition pattern through which a deposition material is deposited to a deposition target; a frame to which the mask comprising the deposition pattern is combined; and a pattern position adjusting mechanism which is coupled to the frame and configured to apply a force to the frame such that a position of the deposition pattern of the mask combined to the frame is changed.

A tensioning frame (22) for tensioning a printing screen (3) comprises a plurality of elongate beams (30A-30D) which extend around the periphery of the printing screen (3) and define the tensioning frame (22), wherein at least one of the beams (30A-30D) comprises an opening (32) which is dimensioned to permit a printing screen (3) to be received therethrough, in a lateral direction (A). Mechanisms are described for engagement of the tensioning screen (22) and printing screen (3), as well as an apparatus and a method permitting the lateral loading of the printing screen (3).

Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.