A semiconductor device includes a circuit board including an insulating layer having opposite front and rear surfaces, an electrode pad disposed on the front surface, a housing having an installation area for the circuit board, and a bonding material embedded in a recess within either a first area located at the rear surface of the insulating layer directly below an area of the circuit board in which the electrode pad is disposed, or at a second area located within the installation area of the housing and corresponding to the first area in a plan view.

The present invention relates to a printing method comprising a step of printing a pattern on a substrate, preferably by ink jet printing, followed by a gold plating step by means of contact between the pre-printed pattern to be gold plated and a gold plating deposition device, such as a preferably conductive metal sheet, e.g. a multilayer film comprising a preferably conductive metal sheet.

A flexible circuit board includes an electrically insulating cover layer, at least one electrical component arranged on the upper side of the cover layer with electrical contacts, a conducting track structure arranged on the underside of the cover layer and with contact regions, wherein the electrical contacts are each electrically conductively connected to one of the contact regions through one of a plurality of openings in the cover layer, a heat sink which is thermally conductively connected to each electrical component through the cover layer, and a layer with high conductivity. To create an improved cooling capacity of the electrical component, the heat arising in the electrical components is first dissipated effectively within the conducting paths of the conducting path structure and then dissipated out of the conducting paths directly into the heat sink by the layer with high heat conductivity.

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

A honeycomb core includes a honeycomb substrate comprised of a number of sheets. A number of traces are printed onto the sheets of the honeycomb substrate. A number of integrated electronic devices are disposed within the honeycomb substrate. The integrated electronic devices are electrically coupled to the traces.

A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.

An electronic assembly includes an elastic substrate, a stretchable conductor layer, an electronic element and a compressible elastic conductor. The stretchable conductor layer is arranged on the elastic substrate, the electronic element is located on one side of the stretchable conductor layer facing away from the elastic substrate, and the stretchable conductor layer is electrically connected to the electronic element. The compressible elastic conductor is at least partially located between the stretchable conductor layer and the electronic element.

A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.

Disclosed is a silver nanowire patterning method including patterning an adhesive conductive polymer thin-film on a substrate, fabricating a polydimethylsiloxane (PDMS) stamp coated with a silver nanowire thin-film, and bonding the substrate patterned with the conductive polymer thin-film to the PDMS stamp coated with the silver nanowire thin-film and then separating the two bonded substrates.

Provided is a device configured to manufacture a conductive film including a rotating member, a first syringe, and a second syringe. The rotating member rotates about an axis extending in a first direction. The first syringe is disposed over a first portion of the rotating member, and is configured to discharge a first polymer and conductive balls. The second syringe is adjacent to the first syringe, and is configured to discharge a second polymer.