A method for creating patterned coatings on a molded article includes providing a molded article which has a surface comprising a first area and a second area, at least one surface property in the first area of the surface being different from that in the second area, applying a coating covering at least the first area and the second area to the surface of the molded article, the adhesion of said coating being greater in the first area than in the second area because of the at least one different surface property, and partially removing the coating by means of a removal process which is applied to the entire coating at a constant removal power that is determined such that the entire coating is removed in the second area while the coating remains in place on an entire surface of the first area.

A semiconductor device includes a circuit board including an insulating layer having opposite front and rear surfaces, an electrode pad disposed on the front surface, a housing having an installation area for the circuit board, and a bonding material embedded in a recess within either a first area located at the rear surface of the insulating layer directly below an area of the circuit board in which the electrode pad is disposed, or at a second area located within the installation area of the housing and corresponding to the first area in a plan view.

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 m to 2 m on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.

A method for forming on a substrate (108; 214) a pattern of a material, the method comprising: providing (S100) a material layer (104); providing (S104, S106) an adhesive layer (106), wherein at least one of the material layer (104) or the adhesive layer (106) comprises a pattern corresponding to the pattern to be formed on the substrate (108; 214); and transferring (S108) the material to the substrate (108; 214) with the adhesive fixing the material to a surface (110; 216) of the substrate (108; 214). This solves the problem of forming on a substrate a pattern of a material that, in general, cannot be applied to the substrate directly due to the fact that the material cannot be printed and/or has no or reduced adherence properties with respect to the substrate.

The present disclosure relates to a method for manufacturing a circuit board. The method for manufacturing the circuit board includes forming a patterned first dielectric layer on a substrate; forming an adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the adhesive layer; and patterning the second dielectric layer and the adhesive layer.

This invention provides a carrier or submount for high power devices packaging and a method for forming the carrier or submount. The carrier comprises a thermal conductive ceramic substrate, a patterned adhesion layer on the substrate, a heat dissipation layer on the patterned adhesion layer, a conformal cover layer enclosing the heat dissipation layer and the adhesion layer, a diffusion barrier layer on the conformal cover layer, an eutectic bonding layer on the diffusion barrier layer, and a dissipation ceramic substrate with an L-shape bonding conductor, wherein one end of the L-shape bonding conductor bonds to the power device and the other end bonds to the conformal cover layer at the second region. The substrate includes a first region for bonding high power device, a second region for wire-bonding, and a third region for heat sink. The first region and second region are on a first surface of the substrate, and the third region is one the second surface, opposite to the first surface, of the substrate.

The invention provides a light generating device (1000) comprising s1 light sources (100) and a support (200) configured to support the s1 light sources (100), wherein the s1 light sources (100) are configured to generate light source light (101), wherein s1>1 and wherein: (a) the support (200) comprises n1 domains (210), wherein n1>3, wherein the support (200) comprises k1 fold lines (220), wherein k1>2, wherein at least three of the n1 domains (210) are separated by at least two of the k1 fold lines (220); wherein the domains (210) have a first domain side (211) and a second domain side (212); (b) the at least three of the n1 domains (210) and the at least two of the k1 fold lines (220) are configured parallel; and (c) the light generating device (1000) comprises m1 adhesive layers (400), wherein m1>2; and wherein at least two of the m1 adhesive layers (400) are functionally coupled to different domain sides (211,212) of one or more domains (210).

A circuit board includes a substrate, a first dielectric layer, an adhesive layer, a second dielectric layer, and a conductive line. The first dielectric layer is disposed on the substrate. The adhesive layer is bonded to the first dielectric layer and has at least one through hole. The through hole has an inner wall. The second dielectric layer is disposed on the adhesive layer and has a second through hole communicated with the first through hole. The conductive line is located in the second through hole of the second dielectric layer and is in contact with the inner wall of the adhesive layer.

A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.