A method and structure for forming conductive structure such as an electric circuit, or a portion of an electric circuit, can include the use of a thermal print head and a ribbon including a carrier and a metal layer. The thermal print head is used to print a first portion of the metal layer onto a sacrificial print medium. The first portion printed has a first pattern, where a second portion having a second pattern remains on the carrier. The first pattern is a reverse image at least a portion of the electric circuit, while the second pattern includes at least a portion of the electric circuit. The second portion having the second pattern can be transferred to a circuit substrate, then used as an electric circuit.

In a method and system for laser induced forward transfer (LIFT), energy (E1,E2) is deposited according to a non-Gaussian intensity profile (Ixy) which is spatially tuned across an interface (11xy) of the donor material (11m) to cause the donor material (11m) to be ejected from the donor substrate as an extended jet (Je) momentarily bridging the transfer distance (Zt) between the donor substrate (11) and the acceptor substrate (12) during a transfer period (Tt). A locally increased intensity spike (Is) at a center of the intensity profile (Ixy) causes a relatively thick jet (J1) of donor material to branch into a relatively thin jet (J2) at a branching position (J12) between the donor substrate (11) and acceptor substrate (12). The thick jet (J1) allows a relatively large transfer (Zt) distance while the thin jet (J2) deposits a relatively small droplet (Jd) of donor material (11m).

A method of depositing a donor material onto a target surface is provided herein, in which a first main side of a substrate is covered with a stretchable layer that is attaching thereto with a sealing around an enclosed area at the first main side, therewith defining an enclosure. The stretchable layer has an outer surface that faces away from the substrate, and that is patterned with one or more recessed areas filled with the donor material to be deposited. A relatively high pressure is provided in an interior of the enclosure so that its volume is increased and the patterned surface of the stretchable layer is pressed against the target surface. In that state of the stretchable layer the substrate is irradiated at a second main side opposite its first main side with photon radiation that has an intensity and a duration that causes a transfer of donor material from the one or more recessed areas to the target surface. Also a plate and a deposition device are provided.

The present invention relates to a printing method comprising a step of printing a pattern on a substrate, preferably by ink jet printing, followed by a gold plating step by means of contact between the pre-printed pattern to be gold plated and a gold plating deposition device, such as a preferably conductive metal sheet, e.g. a multilayer film comprising a preferably conductive metal sheet.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

A ceramic substrate is provided in which an inclined protrusion is formed on boundary surface of a metal layer bonded to a ceramic base so as to increase bonding strength; and a manufacturing method therefor. The inclined protrusion may include: a tapered protrusion and a multi-stepped protrusion formed on the boundary surface of the metal layer according to an interval between the metal layer bonded to the ceramic base and a neighboring metal layer, wherein a multi-stepped protrusion having an inclination angle within a predetermined angle range with respect to the ceramic base may be formed on the boundary surface of the metal layer where stress is concentrated, such as the short edge, apex, corner, and the like, and a tapered protrusion may be formed on a remaining portion of the boundary surface of the metal layer.

A method for metallization includes providing a transparent donor substrate (34) having deposited thereon a donor film (36) including a metal with a thickness less than 2 μm. The donor substrate is positioned in proximity to an acceptor substrate (22) including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets (44) of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace (25) in ohmic contact with the semiconductor material.

The present disclosure concerns methods for the manufacturing of products with printed conductive tracks. The process comprising scribing a first trench into the surface of the object, wherein on a border of the trench a first ridge is formed to define a first edge of a material receiving track. At a distance from the first trench a second trench is formed, wherein on the borders of the second trench a second ridge is formed facing the first ridge. The first and second ridges define a material receiving track which may be provided with a material suited to form a conductive track.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

In a method and system for laser induced forward transfer (LIFT), energy (E1,E2) is deposited according to a non-Gaussian intensity profile (Ixy) which is spatially tuned across an interface (11xy) of the donor material (11m) to cause the donor material (11m) to be ejected from the donor substrate as an extended jet (Je) momentarily bridging the transfer distance (Zt) between the donor substrate (11) and the acceptor substrate (12) during a transfer period (Tt). A locally increased intensity spike (Is) at a center of the intensity profile (Ixy) causes a relatively thick jet (J1) of donor material to branch into a relatively thin jet (J2) at a branching position (J12) between the donor substrate (11) and acceptor substrate (12). The thick jet (J1) allows a relatively large transfer (Zt) distance while the thin jet (J2) deposits a relatively small droplet (Jd) of donor material (11m).