Patent classifications
H05K2203/0534
Connection structure and method for manufacturing connection structure
A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member; and curing the first composite and the second composite.
Methods, apparatus, and systems for fabricating solution-based conductive 2D and 3D electronic circuits
This work develops a novel microfluidic method to fabricate conductive graphene-based 3D micro-electronic circuits on any solid substrate including, Teflon, Delrin, silicon wafer, glass, metal or biodegradable/non-biodegradable polymer-based, 3D microstructured, flexible films. It was demonstrated that this novel method can be universally applied to many different natural or synthetic polymer-based films or any other solid substrates with proper pattern to create graphene-based conductive electronic circuits. This approach also enables fabrication of 3D circuits of flexible electronic films or solid substrates. It is a green process preventing the need for expensive and harsh postprocessing requirements for other fabrication methods such as ink-jet printing or photolithography. We reported that it is possible to fill the pattern channels with different dimensions as low as 10?10 ?m. The graphene nanoplatelet solution with a concentration of 60 mg/mL in 70% ethanol, pre-annealed at 75? C. for 3 h, provided ?0.5-2 kOhm resistance. The filling of the pattern channels with this solution at a flow rate of 100 ?L/min created a continuous conductive graphene pattern on flexible polymeric films. The amount of graphene used to coat 1 cm.sup.2 of area is estimated as ?10 ?g. A second method regarding the transfer of graphene material-based circuits with small features size (5 ?m depth, 10 ?m width) from any solid surface to flexible polymeric films via polymer solvent casting approach was demonstrated. This method is applicable to any natural/synthetic polymer and their respective organic/inorganic solvents.
Method for forming insulating layer, method for producing electronic device, and electronic device
By flexographic printing or inkjet printing, insulating ink is applied on a wiring pattern in accordance with a predetermined printing pattern. The insulating ink is hardened, whereby an insulating layer is formed. A contact region of the wiring pattern that is used for electrical connection with a conductor other than the wiring pattern is not covered with the insulating layer. The printing pattern is delimited by the outline of a non-printing region including the contact region. The wiring pattern includes, in the non-printing region, a trunk wiring line leading, to the contact region, from a position on the wiring pattern at which the wiring pattern overlaps with the outline and a branch wiring line extending from a point on at least one side of the trunk wiring line and terminating without making contact with the outline.
Method for forming insulating layer, method for producing electronic device, and electronic device
By flexographic printing or inkjet printing, insulating ink is applied on a wiring pattern in accordance with a predetermined printing pattern. The insulating ink is hardened, whereby an insulating layer is formed. A contact region of the wiring pattern that is used for electrical connection with a conductor other than the wiring pattern is not covered with the insulating layer. The printing pattern is delimited by the outline of a non-printing region including the contact region. The wiring pattern includes, in the non-printing region, a trunk wiring line leading, to the contact region, from a position on the wiring pattern at which the wiring pattern overlaps with the outline and a branch wiring line extending from a point on at least one side of the trunk wiring line and terminating without making contact with the outline.
UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby
The present invention relates to a UV-curable ink composition, a method for producing a bezel pattern of a display substrate using same, and a bezel pattern produced thereby, the UV-curable ink composition comprising a colorant, an epoxy compound, an oxetane compound, a photopolymerization initiator, and a surfactant comprising a polar functional group, wherein the content ratio of the epoxy compound to the oxetane compound is 1:0.5-1:6, an adhesion to a glass substrate after curing is 4B or higher according to the ASTM D3359 standard, a contact angle to the glass substrate is less than 10, and an adhesion with a substrate coated with an adhesive layer after curing is 100-5,000 gf/25 mm.
UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby
The present invention relates to a UV-curable ink composition, a method for producing a bezel pattern of a display substrate using same, and a bezel pattern produced thereby, the UV-curable ink composition comprising a colorant, an epoxy compound, an oxetane compound, a photopolymerization initiator, and an adhesion promoter, wherein the content ratio of the epoxy compound to the oxetane compound is 1:0.5-1:6, and an adhesion to a glass substrate after curing is 4B or higher according to the ASTM D3359 standard.
CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member; and curing the first composite and the second composite.
UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby
The present invention relates to a UV-curable ink composition, a method for producing a bezel pattern of a display substrate using same, and a bezel pattern produced thereby, the UV-curable ink composition comprising a colorant, an epoxy compound, an oxetane compound and a photopolymerization initiator, wherein the content ratio of the epoxy compound to the oxetane compound is 1:0.5-1:6.
TOUCH PANEL AND TOUCH PANEL PRODUCTION METHOD
A touch panel comprises, a substrate, a layered structure formed in a sensing region defined on one side of the substrate, the layered structure including at least a first conductor layer made of a first hardened conductive ink, a second conductor layer made of a second hardened conductive ink and an insulating layer disposed therebetween, and an external connection terminal formed outside the sensing region on the one side of the substrate, wherein the external connection terminal comprises a first terminal layer made of the first hardened conductive ink and a second terminal layer made of the second hardened conductive ink, such that the first terminal layer and the second terminal layer are directly overlaid on each other.
UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby
The present invention relates to a UV-curable ink composition, a method for producing a bezel pattern of a display substrate using same, and a bezel pattern produced thereby, the UV-curable ink composition comprising a colorant, an epoxy compound, an oxetane compound and a photopolymerization initiator, wherein a content ratio of the epoxy compound to the oxetane compound is 1:0.5 to 1:6 and the curing dose amount of the ultraviolet curable ink composition is 20 to 5,000 mJ/cm.sup.2.