A display device includes a flexible insulating substrate, an insulating layer on the insulating substrate, and a plurality of terminals made of a conductive material on the insulating layer. The insulating layer is disposed outside the area located between the terminals. The insulating substrate has a groove between the terminals.

Provided are a printed circuit board and a method for manufacturing the same, the printed circuit board including: an insulating member; a first pad disposed in the insulating member; a plurality of first vias respectively disposed on a lower side of the first pad in the insulating member and connected to the first pad; and a second via disposed on an upper side of the first pad in the insulating member and connected to the first pad.

A multilayer rigid flexible printed circuit board including a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

A printed circuit board includes, an insulating substrate, a metal conductor which is formed on the insulating substrate, a solder resist coating a part of the metal conductor, a scooped-out portion of the metal conductor formed in the vicinity of an end of the solder resist, and a metal layer coating the scooped-out portion.

A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.

The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

A wiring board includes a board including a core, a conductive layer on the core, and a laminated structure over the core and conductive layer, and a stacked structure formed in the board and including a through-hole conductor through the core and a via conductor in the laminated structure. The through-hole conductor has though-hole portion through the core and land portion on the core, the laminated structure includes an insulation layer in which the via conductor is formed, the via conductor is stacked on the land portion such that the stacked structure including the through-hole and via conductors is formed through the core and the insulation layer, and the stacked structure is formed such that the through-hole portion has end connected to the land portion and the end has width set greater than width of bottom of the via conductor and smaller than width of top of the via conductor.

A method for manufacturing a circuit board includes providing a composite material film including a metal film and a polymeric film, disposing a dielectric layer on the polymeric film to form a stacked structure, forming a circuit layer with a contact pad on a substrate, bonding the stacked structure onto the substrate and the circuit layer, and forming a first opening extending through the metal film to form a patterned metal film. The dielectric layer directly contacts the substrate and entirely covers the circuit layer. The method further includes plasma etching the dielectric layer with the patterned metal film as a mask to form a second opening in the dielectric layer and expose the contact pad in the second opening, removing the composite material film, and depositing a conductive material in the second opening to form a conductive blind hole electrically connected to the contact pad.

A material sheet for circuit board fabrication is provided. The material sheet includes liquid crystal polymer (LCP) fibers impregnated in a dielectric having a dissipation factor between 0.004 and 0.0002.

A stacked structure for circuit board includes a composite material film, a dielectric layer, and a release film. The composite material film includes a metal film and a polymeric film. The dielectric layer is disposed on the composite material film and directly contacts the polymeric film. The release film is disposed on the dielectric layer and directly contacts the dielectric layer.