A method for manufacturing a circuit, in particular of a hearing aid, in which method a printed circuit board is made available with a first region and with a second region which are separated by means of a boundary. A component is mounted on the printed circuit board, wherein the component is positioned on the boundary. The first region is covered by means of a mask which has an edge, wherein the edge is positioned on the component, and the printed circuit board is provided with a coating. The coating is cut away in the region of the component and the mask is removed.

A resin film configured to hold a conductive metallic track against a panel. The resin film partially covers the conductive metallic track, such that the conductive metallic track has at least one region which does not have the resin film, so as to allow an electrical connection by contact. Thus, in the context of assembly on a panel, the metallic track incorporated between the panel and the resin film is protected, thus rendering this technical solution particularly robust. Furthermore, the resin film electrically insulates the metallic track from surrounding elements, and the regions which do not have resin film allow an electrical connection by contact.

A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base.

A connection method for a chip and a circuit board includes: placing the circuit board on the chip, the circuit board having a first surface in contact with the chip having a plurality of contacts, and the circuit board having a plurality of through holes aligned with the plurality of contacts respectively; placing a mask on a second surface of the circuit board, the mask having a plurality of openings aligned with the plurality of through holes respectively; covering a surface of the mask with a conductive adhesive to fill the plurality of through holes with the conductive adhesive; and keeping portions of the conductive adhesive that are respectively in the plurality of through holes to be spaced apart from each other. The portions of the conductive adhesive that fill the plurality of through holes remain to provide an electrical connection between the circuit board and the chip.

The present disclosure relates to an apparatus for manufacturing FPCB and method for manufacturing FPCB, having no limitations of length of a circuit pattern being formed on a base film.

A circuit board and a manufacturing method thereof are provided. The circuit board includes a dielectric substrate, a circuit pattern and a dielectric layer. The circuit pattern is disposed on the dielectric substrate. The dielectric layer is disposed on the dielectric substrate and covers the circuit pattern. The dielectric layer includes a dielectric matrix and a mesh-shaped fiber structure disposed in the dielectric matrix. There is no mesh-shaped fiber structure on a portion of the dielectric substrate exposed by the circuit pattern.

One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.

The present invention includes the steps of applying a liquid deposition material on a display surface of a display panel through a metal mask which is in close contact with the display surface of the display panel, while heating the metal mask; and forming thin film patterns by heating and baking the applied liquid deposition material.

A printed circuit board comprises a support structure, a conductive layer operably coupled to the support structure, a mask structure formed on the conductive layer, and a cover layer. The conductive layer comprises first and second portions of conductive material separated by a gap that defines a spacing between the first and second portions that does not contain conductive material. The mask structure defines first and second regions on the conductive layer. The first region is enclosed by a first boundary defined by the mask structure and includes the gap. The second region lies outside of the first boundary. The cover layer is sized to fit within the first region and comprises a laminatible insulating material that flows within the first region during lamination. During lamination, the first boundary prevents the laminatible insulating material from flowing into the second region, and the laminatible insulating material flows to fill the gap.

A laminated structure includes metal tracks. In a method for making, a first layer of a first dielectric material is deposited on a substrate. One or more openings are then made in the first layer. A second dielectric material is then deposited within the openings formed in the first layer. The second dielectric material has dielectric properties distinct from the dielectric properties of the first dielectric material.