The present invention relates to a production process for a solder electrode, including: a step (1) of forming a coating film of a photosensitive resin composition on a substrate having an electrode pad; a step (2) of forming resist having an opening in a region corresponding to the electrode pad by selectively exposing the coating film to light and further developing the film; and a step (3) of filling the opening with molten solder, in which the photosensitive resin composition contains at least a benzoxazole precursor. According to the production process for the solder electrode of the present invention, development of cracks on a resist surface can be prevented, and solder filling capability can be improved, even when the resist receives high heat during solder filling as in an IMS method, and therefore the solder electrode adapted for the purpose can be appropriately produced.

Methods of forming a microelectronic structure are described. Those methods comprise forming a stress compensation layer on a substrate, forming at least one opening within the stress compensation layer, and forming an interconnect paste within the at least one opening.

A stretchable wire including a stretchable solid-phase conductive structure; a stretchable insulation layer which surrounds the solid-phase conductive structure; and a liquid-phase conductive material layer disposed between the solid-phase conductive structure and the stretchable insulation layer, and in contact with the solid-phase conductive structure, and a method of fabricating the same.

Methods of achieving precision registration in a roll to roll process for making patterned substrates by depositing first and second inks in a predetermined pattern, the predetermined pattern having fiducial marks and main pattern marks. One of these inks prints the fiducial marks onto a substrate while another ink prints main pattern marks on the same substrate such that the predetermined pattern bears a predictable spatial relationship to the pattern of fiducial marks. Consequently, even if the ink forming the predetermined pattern is invisible, or has such low contrast with the substrate that it is effectively invisible, or even has been dissolved away in a subsequent processing step, it is still possible to know where the predetermined pattern is by referring to the pattern of fiducial marks. Touch screen displays including patterned substrates prepared of the methods are also disclosed.

Provided is a stretchable wire including: a stretchable solid-phase conductive structure; a stretchable insulation layer which surrounds the solid-phase conductive structure; and a liquid-phase conductive material layer disposed between the solid-phase conductive structure and the stretchable insulation layer, and in contact with the solid-phase conductive structure, and a method of fabricating the same.

Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

Methods of achieving precision registration in a roll to roll process for making patterned substrates by depositing first and second inks in a predetermined pattern, the predetermined pattern having fiducial marks and main pattern marks. One of these inks prints the fiducial marks onto a substrate while another ink prints main pattern marks on the same substrate such that the predetermined pattern bears a predictable spatial relationship to the pattern of fiducial marks. Consequently, even if the ink forming the predetermined pattern is invisible, or has such low contrast with the substrate that it is effectively invisible, or even has been dissolved away in a subsequent processing step, it is still possible to know where the predetermined pattern is by referring to the pattern of fiducial marks. Touch screen displays including patterned substrates prepared of the methods are also disclosed.

Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

A method for forming a resist fine pattern uses inkjet printing for printing an ink along a path to form a resist fine pattern on a substrate having the same surface energy. The method includes an ejecting step of simultaneously discharging a photocurable resist ink and a partition-forming ink that are spaced from each other on the front side and the rear side of the path and applying the light energy to the discharged photocurable resist ink. The intensity of light is set so that, as the photocurable resist ink is semi-cured and is ejected on the substrate in a gelatinous state, the ink forms a boundary that is vertical with respect to the partition-forming ink ejected on the substrate and the spreading of the photocurable resist ink is prevented, and the photocurable resist ink is cured after both the photocurable resist ink and the partition-forming ink are completely ejected.

The ink according to the present invention is an actinic radiation-curable inkjet resist ink comprising an actinic radiation-polymerizable compound (A), a pigment (B), and a pigment dispersant (C), wherein: the pigment (B) contains a red pigment (B1) having a maximum absorption wavelength from 480 nm to 600 nm and a pigment (B2) having a color different from that of the red pigment (B1); the pigment dispersant (C) has an amine value larger than its acid value; the halogen content in the inkjet resist ink is not more than 900 ppm; and the actinic radiation-curable inkjet resist ink substantially does not contain a black inorganic pigment.