A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.

A method for manufacturing a wiring board includes: disposing a first resist material on a substrate; forming a first resist layer by curing the first resist material; forming a resin layer on a release film; forming a conductor portion on the resin layer; covering the conductor portion by disposing a second resist material on the resin layer; forming a second resist layer by curing the second resist material; bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and releasing the release film from the resin layer.

A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings.

Provided is a method for manufacturing a wiring substrate. The method includes forming a resist layer on a support body, exposing the resist layer, developing the exposed resist layer to form an opening in the resist layer, forming a metal wiring in the opening, and removing the resist layer after the metal wiring is formed. In the exposing of the resist layer, a wiring exposure pattern that corresponds to the metal wiring, and a dummy exposure pattern that does not correspond to the metal wiring are exposed to the resist layer. At least a part of the dummy exposure pattern is located in a region within 200 m from an end portion of the wiring exposure pattern.

A wiring board includes: an external connection terminal provided at a bottom surface of the wiring board; an insulating layer around the external connection terminal; and a wiring layer that is layered on the insulating layer and is electrically connected with the external connection terminal through a via provided in the insulating layer; wherein the external connection terminal has a bottom conductive layer that constitutes a bottom surface of the external connection terminal with a plurality of protrusions protruding upward on a top surface of the bottom conductive layer.

A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.

A hard disk drive flexure assembly includes an insulative base layer over a metal substrate, a first conductive layer over the base layer, a plurality of electrical pads each comprising a second conductive layer over the first conductive layer, a pre-formed bump of solder material positioned over each pad, and a conductive cover layer over at least a portion of each pre-solder bump. With the conductive cover layer, e.g., gold, solder material from each pre-solder bump is inhibited from transferring to a probe during electrical check of the flexure, the solder material is inhibited from oxidizing, and solder splash is inhibited. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.

A method for forming a resist fine pattern uses inkjet printing for printing an ink along a path to form a resist fine pattern on a substrate having the same surface energy. The method includes an ejecting step of simultaneously discharging a photocurable resist ink and a partition-forming ink that are spaced from each other on the front side and the rear side of the path and applying the light energy to the discharged photocurable resist ink. The intensity of light is set so that, as the photocurable resist ink is semi-cured and is ejected on the substrate in a gelatinous state, the ink forms a boundary that is vertical with respect to the partition-forming ink ejected on the substrate and the spreading of the photocurable resist ink is prevented, and the photocurable resist ink is cured after both the photocurable resist ink and the partition-forming ink are completely ejected.

A hybrid mold that is used for forming a wiring structure including wiring and vias connecting pieces of the wiring in different layers to each other, the hybrid mold includes a body made of an optically transparent material, a masking pattern made of an opaque material and disposed on a first surface of the body and a pillar structure including a plurality of pillars made of the optically transparent material and protruding from a second surface of the body, the second surface being opposite to the first surface. The masking pattern has shape and placement corresponding to shape and placement of the wiring when viewed from a direction orthogonal to the first surface, and the plurality of pillars each has shape and placement corresponding to shape and placement of the vias when viewed from the direction orthogonal to the first surface.