A printed circuit board (PCB) (4) including an upper surface having one or more electrical terminals (9) thereon, said terminal adapted for connection to corresponding terminal of one or more electrical components, and further including one or more platforms (10) fabricated thereon, said platforms being located adjacent to corresponding component terminals, said platforms being adapted to support an electrical component thereupon, such that a portion of the component overhangs said platform above said corresponding PCB terminal.

A flexible printed circuit board with reduced ion migration from signal-carrying elements which are coated against corrosion includes an insulating layer, a wiring area, a copper electroplating layer, a nickel electroplating layer, a cover film, and a gold chemical-plating layer. The wiring area is formed on the insulating layer. The copper electroplating layer formed on the wiring area has a first portion and a second portion. The nickel electroplating layer is formed on at least the first portion and exposes sidewalls of the first portion. The cover film is formed on the second portion and fills in gaps of the copper electroplating layer. The gold chemical-plating layer is formed on top surface of the nickel electroplating layer and the sidewalls of the first portion.

A flexible printed circuit board with reduced ion migration from signal-carrying elements which are coated against corrosion includes an insulating layer, a wiring area, a copper electroplating layer, a nickel electroplating layer, a cover film, and a gold chemical-plating layer. The wiring area is formed on the insulating layer. The copper electroplating layer formed on the wiring area has a first portion and a second portion. The nickel electroplating layer is formed on at least the first portion and exposes sidewalls of the first portion. The cover film is formed on the second portion and fills in gaps of the copper electroplating layer. The gold chemical-plating layer is formed on top surface of the nickel electroplating layer and the sidewalls of the first portion.

The present invention concerns an electronic module with at least one component embedded in insulating material. The electronic module comprises a first insulating material having a first surface and a second surface and a thickness between the first surface and the second surface, at least one opening through the first insulating material, a second insulating material on the second surface of the first insulating material, at least one component embedded in the second insulating material, at least one conductive pattern in the at least one opening, the at least one conductive pattern having a first surface and a second surface, wherein the second surface faces the second insulating material and the first surface faces away from the second insulating material and a distance between the first surface of the first insulating material and the second surface of the at least one conductive pattern is less or greater than the thickness of the first insulating material, an adhesive between the first insulating material and the at least one component, and connection elements between the at least one conductive pattern and the at least one component. The present invention further concerns a method for fabrication of an electronic module with at least one component embedded in an insulating layer.

A printed circuit board (PCB) having an improved waterproof structure for preventing corrosion of a substrate is disclosed. A plurality of screen-printed protrusions is provided at the PCB surface. The plurality of protrusions allow water to be formed in waterdrops so that the waterdrops can flow to the outside of the PCB. The PCB is arranged to have a tilted structure for facilitating discharge of the water. The tilted structure discharges waterdrops to a lower side of the PCB. The PCB and a PCB assembly having the same are applicable to electronic appliances such as a washing machine.

Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.

A method of forming an electronic assembly. The method includes covering a patterned conductive layer that is on a dielectric layer with a solder resist; depositing a metal layer on to the solder resist; depositing a photo resist onto the metal layer; patterning the photo resist; etching the metal layer that is exposed from the photo resist to form a metal mask; removing the photo resist; and plasma etching the solder resist that is exposed from the metal mask. An electronic assembly for securing for an electronic card. The electronic assembly includes a patterned conductive layer that is on a dielectric layer; and a solder resist covering the patterned conductive layer and the dielectric layer, wherein the solder resist includes openings that expose the patterned conductive layer, wherein the openings in the solder resist only have organic material on side walls of the respective openings.

A method of forming a circuit board includes forming a conductive pattern on a substrate; forming a first negative resist on the substrate after formation of the conductive pattern; partially exposing the first negative resist on the surface of the conductive pattern to form a first via exposure portion; forming a second negative resist on the substrate after formation of the first via exposure portion; partially exposing the second negative resist on the first via exposure portion to form a second via exposure portion larger than the first via exposure portion; developing the first negative resist and the second negative resist after formation of the second via exposure portion to form a via opening reaching the conductive pattern; and filling the via opening with a conductive material.

A method of forming a circuit board includes forming a conductive pattern on a substrate; forming a first negative resist on the substrate after formation of the conductive pattern; partially exposing the first negative resist on the surface of the conductive pattern to form a first via exposure portion; forming a second negative resist on the substrate after formation of the first via exposure portion; partially exposing the second negative resist on the first via exposure portion to form a second via exposure portion larger than the first via exposure portion; developing the first negative resist and the second negative resist after formation of the second via exposure portion to form a via opening reaching the conductive pattern; and filling the via opening with a conductive material.

An electronic apparatus is provided including a substrate, a conductive land formed on a surface of the substrate, an electronic component including an electrode, at least one insulating protrusion formed on the land in an overlapping region between the land and the electrode in plan view, and a solder that bonds the electronic component to the land, the solder being formed between the electrode and the land in the overlapping region in a normal direction to the surface of the substrate.