Pyrimidine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants.

A method for producing a circuit board structure includes an ink layer forming process implemented by forming an ink layer on a side surface of a core substrate; a laminating process implemented by laminating two inner substrates onto the two side surfaces of the core substrate; a thru-hole forming process implemented by forming a thru-hole that penetrates through the two inner substrates, the ink layer, and the core substrate; an activating process implemented by forming an activation layer covering an inner side wall of the thru-hole and the ink layer; an ink removing process implemented by removing the ink layer and portions of the activation layer covering the ink layer in the thru-hole; and a plating process implemented by performing a plating operation to replace the activation layer that remains on the inner side wall of the thru-hole with a plating layer to form a circuit board structure.

The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) or IC substrates including through-holes and/or grate structures filled with copper, which comprises the steps of: a) providing a multi-layer substrate; b) forming a non-copper conductive layer or a copper layer on the cover layer and on an inner surface of the through-hole, respectively on an inner surface of the grate structure; c) forming a patterned masking film; d) electrodepositing copper; e) removing the masking film; and f) electrodepositing a copper filling.

The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.