A wiring board includes a wiring layer; a diffusion suppressing layer that covers the wiring layer and suppresses diffusion of a metal component of the wiring layer; a base metal layer that covers the diffusion suppressing layer; and a passivation layer that covers the base metal layer.

A printed circuit board includes: a base substrate including a unit region; a plurality of connection pads disposed on one surface of the base substrate; and first and second lead-in lines disposed on the one surface and respectively connected to at least a portion of the plurality of connection pads. The first and second lead-in lines have first and second cut surfaces on the one surface, respectively. The first cut surface is disposed in a position spaced apart from a side surface of the printed circuit board. The second cut surface is exposed to the side surface of the printed circuit board.

Provided is a method for forming a through-hole including: forming a laminated body including a fluororesin layer having a first main surface and a second main surface, a first adhesive layer, a first reinforcing resin layer and a first conductor layer provided on the first main surface, a second adhesive layer, a second reinforcing resin layer and a second conductor layer provided on the second main surface; forming an opening in the first conductor layer and irradiating the opening with a laser beam to form a bottomed conduction hole with the second conductor layer exposed on a bottom surface of the conduction hole, wherein a thermal decomposition temperature of the second cured adhesive layer is lower than those of the first reinforcing resin layer and the second reinforcing resin layer, and a thickness of the second cured adhesive layer is 10 μm or more and 200 μm or less.

A printed wiring board includes a first insulator, a second insulator, a first conductor, and a second conductor. The first conductor is between the first insulator and the second insulator. The first conductor contains a first conductive material. The second conductor includes a first portion. The first portion is between the first insulator and the first conductor. The first portion is in contact with the first conductor and extends along the first conductor. The second conductor contains a second conductive material. The second conductive material is lower in electrical resistivity than the first conductive material. The second insulator is closer to an outside of the printed wiring board than the first insulator is in a thickness direction of the printed wiring board.

A printed wiring board includes a first insulator, a second insulator, a first conductor, and a second conductor. The first conductor is between the first insulator and the second insulator. The first conductor contains a first conductive material. The second conductor includes a first portion. The first portion is between the first insulator and the first conductor. The first portion is in contact with the first conductor and extends along the first conductor. The second conductor contains a second conductive material. The second conductive material is lower in electrical resistivity than the first conductive material. The second insulator is closer to an outside of the printed wiring board than the first insulator is in a thickness direction of the printed wiring board.

A printed wiring board includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated so as to run on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 μm or greater to 50 μm or smaller, and an average thickness of the second conductive portion is 1 μm or greater to smaller than 8.5 μm. A method for manufacturing a printed wiring board includes a first conductive portion forming step of forming a first conductive portion forming each wiring portion by plating an opening of the resist pattern on the conductive foundation layer, a conductive foundation layer removing step, and a second conductive portion coating step.

A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.

Systems, methods, and devices related to catalyzed metal foils are disclosed. Contemplated metal foils have a bottom surface, preferably roughened to Ra of at least 0.1 μm, bearing a catalyst material. The metal foils are etchable, typically of aluminum or derivative thereof, and is less than 500 μm thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalyst material bearing surface of the metal foil is applied to a substrate and laminated, in some embodiments with a thermoset resin or thermoplastic resin therebetween or an organic material first coating the catalytic material. The metal foil is removed to expose the catalyst material, and a conductor is plated to the catalyst material.

A circuit board includes a glass substrate having a first surface and a second surface facing away from the first surface; a first coil wiring pattern formed on the first surface and a second coil wiring pattern formed on the second surface, the first and second coil wiring patterns constituting part of a coil; a through hole extending through a predetermined portion of the glass substrate from an end of the first coil wiring pattern to an end of the second coil wiring pattern; a through hole inner conductive surface formed on the inner side of the through hole, the first and second coil wiring patterns and the through hole inner conductive surface constituting the coil wound around a direction perpendicular to an axis of the through hole and to a direction in which the first and second coil wiring patterns extend.

A wiring substrate includes an insulating layer, and a conductor layer including a wiring formed on the insulating layer. The wiring in the conductor layer has a first section and a second section formed such that a wiring width in the second section is smaller than a wiring width in the first section and that a wiring thickness in the second section is larger than a wiring thickness in the first section.