Patent classifications
H
ELECTRICITY
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H05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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H05K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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2203/00
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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H05K2203/07
Treatments involving liquids, e.g. plating, rinsing
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H05K2203/0736
Methods for applying liquids, e.g. spraying
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H05K2203/075
Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
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H05K2203/075

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method
09686871 · 2017-06-20 · ·

A soldering device comprising: a first treatment part that sets a component having an electrode; a second treatment part separated by an opening-closing unit, the second treatment part sending the component on to a third treatment part; the third treatment part separated by an opening-closing unit, the third treatment part causing the component to contact an organic fatty-acid-containing solution and move horizontally; a fourth treatment part having a unit for moving the component to a space portion and causing molten solder to adhere to the electrode; and a unit for removing excess molten solder; a fifth treatment part for horizontally moving the component moved downward by the fourth treatment part; a sixth treatment part separated by an opening-closing unit, the sixth treatment part sending the component on to a seventh treatment part; and the seventh treatment part separated by an opening-closing unit, the seventh treatment part taking out the component.