Patent classifications
H
H05
H05K
2203/00
H05K2203/07
H05K2203/0756
H05K2203/0759
H05K2203/0759
METHOD OF PRODUCING STRUCTURE, METHOD OF PRODUCING INTERIOR COMPONENT, AND METHOD OF PRODUCING ELECTRONIC DEVICE
There is provided a method of producing a structure including a substrate and a resin foam layer bonded to the substrate. The method includes: coating the substrate with a mixture including an ultraviolet curable adhesive and thermally expandable microspheres, the ultraviolet curable adhesive including a photopolymerization initiator and an adhesive resin component; and irradiating the mixture with ultraviolet rays to polymerize the adhesive resin component and expand the thermally expandable microspheres, thereby forming the resin foam layer. The resin foam layer is bonded to the substrate with an adhesive force of the adhesive resin component.