H05K2203/0769

Printing of multiple inks to achieve precision registration during subsequent processing

Methods of achieving precision registration in a roll to roll process for making patterned substrates by depositing first and second inks in a predetermined pattern, the predetermined pattern having fiducial marks and main pattern marks. One of these inks prints the fiducial marks onto a substrate while another ink prints main pattern marks on the same substrate such that the predetermined pattern bears a predictable spatial relationship to the pattern of fiducial marks. Consequently, even if the ink forming the predetermined pattern is invisible, or has such low contrast with the substrate that it is effectively invisible, or even has been dissolved away in a subsequent processing step, it is still possible to know where the predetermined pattern is by referring to the pattern of fiducial marks. Touch screen displays including patterned substrates prepared of the methods are also disclosed.

SELF-SUPPORTED ELECTRONIC DEVICES

A method of forming a self-supported electronic device, including depositing a sacrificial layer on a first surface substrate, wherein the sacrificial layer is substantially soluble in a first solvent. At least one device layer is deposited in a desired pattern on top of the sacrificial layer. The at least one device layer is substantially insoluble in the at least one device layer. The sacrificial layer is at least partially dissolved in the first solvent to release at least a portion of the first device layer from the substrate. The at least one device layer removed from the substrate forms a self-supported electronic device, which is a thin film electronic device having at least a portion thereof that is not supported by a material carrier.

Recyclable circuit assembly

An electronic circuit assembly comprises a substrate and circuit components attached to the substrate by means of an electrically conductive adhesive, wherein the adhesive is releasable under predetermined release conditions, whereby to enable the circuit components to be removed from the substrate for recovery or re-use.

Conductive Patterns and Methods of Using Them
20170164484 · 2017-06-08 ·

Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

Transient Electronic Devices Comprising Inorganic or Hybrid Inorganic and Organic Substrates and Encapsulates

The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

PRINTING OF MULTIPLE INKS TO ACHIEVE PRECISION REGISTRATION DURING SUBSEQUENT PROCESSING
20170115761 · 2017-04-27 ·

Methods of achieving precision registration in a roll to roll process for making patterned substrates by depositing first and second inks in a predetermined pattern, the predetermined pattern having fiducial marks and main pattern marks. One of these inks prints the fiducial marks onto a substrate while another ink prints main pattern marks on the same substrate such that the predetermined pattern bears a predictable spatial relationship to the pattern of fiducial marks. Consequently, even if the ink forming the predetermined pattern is invisible, or has such low contrast with the substrate that it is effectively invisible, or even has been dissolved away in a subsequent processing step, it is still possible to know where the predetermined pattern is by referring to the pattern of fiducial marks. Touch screen displays including patterned substrates prepared of the methods are also disclosed.

Method for producing a high-aspect ratio conductive pattern on a substrate

Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

Hot melt compositions with improved etch resistance

Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.

Hot melt compositions with improved etch resistance

Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.

Patterned conductive structure and method for forming the same

A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.