Disclosed are: a microetching agent which can form roughened shapes less affected by differences in the crystallinity of the copper and with which roughened shape excellent in terms of adhesiveness to resins, etc. can be formed on either electrolytic copper or rolled copper; and a method for producing a wiring board which includes a step of roughening a copper surface using the microetching agent. In the present invention, the microetching agent for copper is an acidic aqueous solution containing an inorganic acid, a cupric ion source, a halide ion source, and a polymer. The polymer has a functional group containing a nitrogen atom. It is preferable that the microetching agent contain a sulfate ion source.

Provided is a slot die with variable nozzles. The slot die with variable nozzles, which applies ink on a substrate to perform a coating process, includes: a first body having a cavity configured to accommodate ink supplied from the outside; a second body spaced apart from the first body in a transfer direction of a substrate or a direction opposite to the transfer direction; a shim plate coupled between the first body and the second body and having an discharge port configured to communicate with the cavity and discharge ink accommodated in the cavity toward the substrate; and a plurality of variable nozzles disposed at a lower end of the first body or the second body in a width direction of the substrate so as to be adjacent to the discharge port, wherein each of the plurality of variable nozzles is independently driven according to a state of the ink coated on the substrate and adjusts a partial discharge amount of the ink discharged from the discharge port by changing a partial area of the discharge port at an arrangement position thereof.

A machine can include a UV zone that includes LED-based UV radiation sources; and a controller that controls conditions within the machine to regulate temperature of the LED-based UV radiation sources.

Manufacturing technology to fabricate liquid metal-based soft and flexible electronics (sensors, antennas, etc.) in a high-throughput fashion, with fabrication rates that may approach that of the traditional integrated circuit components and circuits, are described. The technique allows creation of liquid-metal-only circuits, as well as seamless integration of solid IC chips into the circuits, in which liquid metal traces are used as flexible interconnects and/or as other circuit elements. The process may be applied at the wafer scale and may be integrated into the traditional microelectronics fabrication processes. Many sensors, antennas, and other circuit elements may be directly created using liquid metal, and when combined with the IC chips, a broad range of electronic functionality may be provided in a flexible, soft circuit that can be conformable, wearable.

A self-healing conductive structure includes a conductive layer and a self-healing layer on at least one surface of the conductive layer. The self-healing layer includes a substrate and carbon nanotubes in the insulating matrix, the layer having low viscosity at higher temperatures. When there is a crack in the conductive layer, the self-healing layer flows into the crack, and the carbon nanotubes then in the crack are rearranged under an electric field to repair conductivity. Service life of the conductive structure is improved and signals generated by the conductive structure retain integrity. A method for making the self-healing conductive structure is also provided.

According to an embodiment, a structure is provided. The structure comprises a silicone formed product, water, and a protective member. The silicone formed product contains hydroxyl groups in at least a portion of a surface. The water is in contact with at least the portion of the surface containing the hydroxyl groups. The protective member retains the water.

A self-healing conductive structure includes a conductive layer and a self-healing layer on at least one surface of the conductive layer. The self-healing layer includes a substrate and carbon nanotubes in the insulating matrix, the layer having low viscosity at higher temperatures. When there is a crack in the conductive layer, the self-healing layer flows into the crack, and the carbon nanotubes then in the crack are rearranged under an electric field to repair conductivity. Service life of the conductive structure is improved and signals generated by the conductive structure retain integrity. A method for making the self-healing conductive structure is also provided.

According to one embodiment, a method for manufacturing a ceramic circuit board is disclosed. The ceramic circuit board includes a copper plate bonded to at least one surface of a ceramic substrate via a brazing material layer including Ag, Cu, and a reactive metal. The method includes: preparing a ceramic circuit board in which a copper plate is bonded on a ceramic substrate via a brazing material layer, and a portion of the brazing material layer is exposed between a pattern shape of the copper plate; a first chemical polishing process of chemically polishing the portion of the brazing material layer; and a first brazing material etching process of etching the chemically polished portion of the brazing material layer by using an etchant having a pH of 6 or less and including one type or two types selected from hydrogen peroxide and ammonium peroxodisulfate.

Disclosed are: a microetching agent which can form roughened shapes less affected by differences in the crystallinity of the copper and with which roughened shape excellent in terms of adhesiveness to resins, etc. can be formed on either electrolytic copper or rolled copper; and a method for producing a wiring board which includes a step of roughening a copper surface using the microetching agent. In the present invention, the microetching agent for copper is an acidic aqueous solution containing an inorganic acid, a cupric ion source, a halide ion source, and a polymer. The polymer has a functional group containing a nitrogen atom. It is preferable that the microetching agent contain a sulfate ion source.

In a method for preparing a printed circuit board assembly (PCBA), the PCBA has a base circuit board having a plurality of electronic components installed thereon. First, the surface of the PCBA is cleaned with a cleaner. After cleaning, the staking material is applied around the plurality of electronic components around the circumference of the plurality of electronic components. After applying the staking material, the PCBA with the staking material is cured and inspected.