A controller can include a processor; memory accessible by the processor; a display; and processor-executable instructions stored in the memory and executable by the processor to control: a conveyor that conveys a product that includes a coating; a UV zone that comprises LED-based UV radiation sources that illuminate the coating; and a heating zone that heats the coating.

A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film, and a lightness L* of a conductive pattern non-formed region of the base film is 60 or less. The base film may include a modified layer on one surface side thereof.

A resin composition is provided. The resin composition comprises the following constituents: (A) epoxy resin; (B) a compound of formula (I),

##STR00001## in formula (I), R.sub.1 and R.sub.2 are independently H, CH.sub.3, or C(CH.sub.3); and (C) an optional filler.

The present invention relates to a method for formation of a redistribution layer using photo-sintering and to the redistribution layer formed by the method. The method for forming a redistribution layer using photo-sintering includes printing, on a substrate, a liquid electrode pattern for a redistribution layer; coating a transparent polymer on the substrate and the pattern; photo-sintering the electrode pattern using photonic energy; and evaporating an organic substance contained in the liquid electrode pattern via the photo-sintering to remove the polymer on a top face of the electrode pattern to form a redistribution layer as the sintered electrode pattern.

To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it. A wiring substrate 10 comprising an electrical insulator layer 20, a first conductor layer 32 formed on a first surface of the electrical insulator layer 20, a second conductor layer 34 formed on a second surface of the electrical insulator layer 20, and a plating layer 42 provided on an inner wall surface of a hole 40 which opens from the first conductor layer 32 through the second conductor layer 34; wherein the electrical insulator layer 20 has a heat resistant resin layer 22 containing a heat resistant resin and a resin powder; the resin powder is formed from a resin material containing a melt-formable fluororesin having a functional group such as a carbonyl group-containing group; the content of the resin powder is from 5 to 70 mass % to the heat resistant resin layer 22; and the electrical insulator layer 20 has a dielectric constant of from 2.0 to 3.5.

Methods for orientation and placement of computing devices are presented. Aspects include applying, using a viscous material application device, a layer of a viscous material to a surface of an object, the layer of the viscous material having a plurality of computing devices disposed therein. The layer of the viscous material is allowed to dry during a drying period, wherein each of the plurality of computing devices comprises a first material applied to a first side of each of the plurality of computing devices, the first material having a first characteristic. And each of the plurality of computing devices comprises a second material applied to a second side of each of the plurality of computing devices, the second material having a second characteristic. And each of the plurality of computing devices is configured to perform, during the drying period, a self-orientation operation.

A cleaning apparatus includes at least one cleaning module configured to treat electronic substrates and a conveyor system configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a fluid management system having a manifold coupled to a source of fluid. The manifold includes at least one outlet. The at least one cleaning module further includes an automatic valve coupled to the at least one outlet and to a conduit leading to one or more first spray nozzles and a pressure sensor coupled to the automatic valve. The pressure sensor is configured to measure pressure of fluid flowing through the conduit. The automatic valve is configured to adjust the flow of fluid through the conduit based on the pressure measured by the pressure sensor.

A cleaning apparatus includes at least one cleaning module configured to treat electronic substrates and a conveyor system configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a fluid management system having a manifold coupled to a source of fluid. The manifold includes at least one outlet. The at least one cleaning module further includes an automatic valve coupled to the at least one outlet and to a conduit leading to one or more first spray nozzles and a pressure sensor coupled to the automatic valve. The pressure sensor is configured to measure pressure of fluid flowing through the conduit. The automatic valve is configured to adjust the flow of fluid through the conduit based on the pressure measured by the pressure sensor.

One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.

A printed wiring board includes a laminated base material including an insulating layer and a conductor layer formed on the insulating layer, and a solder resist layer laminated on the laminated material and including photosensitive resin. The resist layer has surface portion and portion in contact with the laminated material, the conductor layer has pattern including conductor pads in contact with the resist layer such that the pads are positioned in openings in the resist layer, and the resist layer satisfies a first condition that a chemical species derived from a photopolymerization initiator has concentration higher in the portion in contact with the laminated material than concentration in the surface portion and/or a second condition that the chemical species derived from the initiator in the portion in contact with the laminated material has photopolymerization initiating ability higher than a chemical species derived from a photopolymerization initiator in the surface portion.