A method for producing a circuit board structure includes an ink layer forming process implemented by forming an ink layer on a side surface of a core substrate; a laminating process implemented by laminating two inner substrates onto the two side surfaces of the core substrate; a thru-hole forming process implemented by forming a thru-hole that penetrates through the two inner substrates, the ink layer, and the core substrate; an activating process implemented by forming an activation layer covering an inner side wall of the thru-hole and the ink layer; an ink removing process implemented by removing the ink layer and portions of the activation layer covering the ink layer in the thru-hole; and a plating process implemented by performing a plating operation to replace the activation layer that remains on the inner side wall of the thru-hole with a plating layer to form a circuit board structure.

A laminated structure includes metal tracks. In a method for making, a first layer of a first dielectric material is deposited on a substrate. One or more openings are then made in the first layer. A second dielectric material is then deposited within the openings formed in the first layer. The second dielectric material has dielectric properties distinct from the dielectric properties of the first dielectric material.

There is described a method of recovering parts of an electronic circuit having a self-supporting substrate having graphene oxide (GO) paper, and at least a conductive trace on the self-supporting substrate. The method generally has a step of immersing the electronic circuit into an environment-friendly solvent, the GO paper thereby dissociating from the conductive trace; and a step of recovering the GO paper from the environment-friendly solvent. The present disclosure also describes an electronic circuit generally having a self-supporting substrate having GO paper with a structural thickness being equal or above a given thickness threshold; and at least a conductive trace on said self-supporting substrate. Further, there is also described a substrate for an electronic circuit in which the substrate generally has a self-supporting substrate having GO paper with a structural thickness being equal or above a given thickness threshold.

A method of forming a patterned conductive film comprises preparing a wafer for deposition. The method includes forming at least a layer above a substrate and patterning a mask comprising a photoresist material on the layer, where the mask comprises a plurality of openings. A plasma jet printer is used to direct a print head assembly towards an opening within the plurality of openings, where the print head assembly comprises an ink dispenser comprising a nanoparticle module. Nanoparticles are deposited, where a first portion of the nanoparticles is formed on the layer, and a second portion of the nanoparticles is formed on an uppermost surface of the mask. The wafer is submerged into an aqueous solution and dissolving portions of the photoresist material in contact with the layer to dislocate the second portion of the nanoparticles and leave the first portion of the nanoparticles to form the patterned conductive film.