Aspects of the present disclosure relate to dispersing graphene oxide in a fluid and washing a first electronic part with cleaning fluid. Aspects of the present disclosure relate to testing cleaning fluid for a concentration of ions, and determining whether the ion concentration is below a threshold. If the ion concentration is below a threshold level, continuing to wash parts with the fluid. If the ion concentration is above a threshold level, replacing the cleaning fluid.

A method of manufacturing a component carrier is described. The method includes forming a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and reducing an amount of solvent in a fiber-free dielectric layer, which is directly connected to a metal layer, so that the dielectric layer with reduced amount of solvent remains at least partially uncured.

A touch sensor having conductive circuits on both surfaces of a substrate is fabricated by including UV-blocking material into the substrate or depositing UV-blocking layer on the substrate. This can be used for fabricating sensors having transparent conductor circuits, or having metallic circuits, which are opaque to visible light. Photoresist is applied to both surfaces of the substrate and patterns are transferred to the photoresist by exposure to UV radiation. The UV-blocking layer prevents UV-radiation applied to one side from exposing the opposite side. If desired, both photoresist layers may be exposed simultaneously by splitting one UV beam.

Disclosed herein are solvent compositions and methods of using the solvent compositions. The solvent composition includes at least trans-1,2-dichloroethylene (t-DCE) and 1,1,2,2-tetrafluoroethyl-2,2,3,3-tetrafluoropropyl ether (TFE-TFPE). The solvent composition may also include an oxygenated solvent, such as an alcohol or fluorinated ether. A method of cleaning the surface of an article includes contacting the surface with the solvent composition to dissolve, disperse, or displace a contaminant on the surface, and removing the solvent composition containing the contaminant from the surface.

The present invention relates to a metal oxide nanoparticle ink composition, a method of producing the same, and a method of forming a conductive layer pattern by using the metal oxide nanoparticle ink composition, and more particularly, to a metal oxide nanoparticle ink composition for forming a conductive layer by irradiating an ink composition thin film containing nickel oxide nanoparticles with a sintering laser, a method of producing the same, and a method of forming a conductive layer pattern by using the metal oxide nanoparticle ink composition.

A conductive slurry for plating comprises a carbon material, a dispersant, a binder, and a solvent. The carbon material, the dispersant and the binder are uniformly mixed in the solvent. The weight percentage of the carbon material is between 0.1% and 1%. The carbon material comprises a carbon nanotube, graphene, or a combination thereof. A plating method for a circuit board, which utilizes the conductive slurry, is also disclosed. The circuit board comprises at least a through hole. The plating method comprises a coating step, a first cleaning step, a first drying step, a first micro-etching step, a second cleaning step, an anti-oxidation step, a third cleaning step, a plating step, and a second drying step.

Aspects of the present disclosure relate to dispersing graphene oxide in a fluid and washing a first electronic part with cleaning fluid. Aspects of the present disclosure relate to testing cleaning fluid for a concentration of ions, and determining whether the ion concentration is below a threshold. If the ion concentration is below a threshold level, continuing to wash parts with the fluid. If the ion concentration is above a threshold level, replacing the cleaning fluid.

The present invention relates to substrates comprising a network comprising core shell liquid metal encapsulates comprising multi-functional ligands and processes of making and using such substrates. The core shell liquid metal particles are linked via ligands to form such network. Such networks volumetric conductivity increases under strain which maintains a substrate's resistance under strain. The constant resistance results in consistent thermal heating via resistive heating. Thus allowing a substrate that comprises such network to serve as an effective heat provider.

Manufacturing technology to fabricate liquid metal-based soft and flexible electronics (sensors, antennas, etc.) in a high-throughput fashion, with fabrication rates that may approach that of the traditional integrated circuit components and circuits, are described. The technique allows creation of liquid-metal-only circuits, as well as seamless integration of solid IC chips into the circuits, in which liquid metal traces are used as flexible interconnects and/or as other circuit elements. The process may be applied at the wafer scale and may be integrated into the traditional microelectronics fabrication processes. Many sensors, antennas, and other circuit elements may be directly created using liquid metal, and when combined with the IC chips, a broad range of electronic functionality may be provided in a flexible, soft circuit that can be conformable, wearable.

The present disclosure relates to a conductive trace precursor composition comprising a metal salt; 3 to 15 weight % of a reducing solvent selected from a lactam and/or a polyol, and water. Where the reducing solvent is 2-pyrrolidinone, the 2-pyrrolidinone is not present in an amount of 5 weight % or in an amount of 7.5 weight % of the conductive trace precursor composition.