This invention forms a multilayer substrate by one apparatus. A multilayer substrate forming method includes fixing a substrate on a stage, forming, on the substrate fixed on the stage, a layer of a mixed material obtained by mixing a conductive material and a photo-curing resin, performing exposure by scanning a laser beam according to first circuit pattern data prepared in advance on the layer of the mixed material, washing away the mixed material on the substrate after the exposure in the performing exposure by scanning the laser beam according to the first circuit pattern data, forming a layer of an insulating resin on the substrate after the cleaning in the washing away the mixed material on the substrate after the exposure in the performing exposure by scanning the laser beam according to the first circuit pattern data, performing exposure by scanning a laser beam according to through hole data prepared in advance on the layer of the insulating resin, washing away the insulating resin on the substrate after the exposure in the performing exposure by scanning the laser beam according to the through hole data, forming a layer of the mixed material on the substrate after the cleaning in the washing away the insulating resin, performing exposure by scanning a laser beam according to second circuit pattern data prepared in advance on the layer of the mixed material, and washing away the mixed material on the substrate after the exposure in the performing exposure by scanning the laser beam according to the second circuit pattern data.

To provide a dispersion excellent in miscibility with varnish, coating properties, dispersibility and dispersion stability; and methods for producing a metal laminate and a printed board. A dispersion comprises an organic solvent and a powder so that the powder is dispersed in the organic solvent, wherein the powder is a powder containing a tetrafluoroethylene type polymer having a melt viscosity at 380 C. of from 110.sup.2 to 110.sup.6 Pa.Math.s; the viscosity is from 50 to 10,000 mPa.Math.s; and the thixotropy ratio calculated by dividing the viscosity measured under the condition of rotational speed of 30 rpm by the viscosity measured under the condition of rotational speed of 60 rpm, is from 1.0 to 2.2.

A fabrication method achieves bump bonds (to connect two electronic devices) with a pitch of less than 20 m using UV-curable conductive epoxy resin cured with an array of nano-LEDs. Nano-LEDs are devices with sizes less than or equal to 5 m, typically arranged in an array. After deposition of the uncured conductive epoxy layer, the nano-LED array enables a fast curing of the bumps with high spatial resolution. Next, the uncured resin is washed off and the chips are assembled, before final thermal curing takes place.

A manufacturing method of a composite substrate is provided. A first conductive layer is formed on a first liquid crystal polymer layer. The first conductive layer is patterned to form a patterned first conductive layer. A second liquid crystal polymer layer including a soluble liquid crystal polymer is formed to cover the patterned first conductive layer. The second liquid crystal polymer layer which is on the patterned first conductive layer is removed.

The present invention relates to substrates comprising a network comprising core shell liquid metal encapsulates comprising multi-functional ligands and processes of making and using such substrates. The core shell liquid metal particles are linked via ligands to form such network. Such networks volumetric conductivity increases under strain which maintains a substrate's resistance under strain. The constant resistance results in consistent thermal heating via resistive heating. Thus allowing a substrate that comprises such network to serve as an effective heat provider.

The present invention relates to architected liquid metal networks and processes of making and using same. The predetermined template design technology of such architected liquid metal networks provides the desired spatial control of electrical, electromagnetic, and thermal properties as a function of strain. Thus, resulting in improved overall performance including process ability.

The present application provides a method for manufacturing a patterned silver nanowire film, a touch screen and a manufacturing method thereof. The method for manufacturing a patterned silver nanowire film, includes: forming a patterned surface modification layer on a substrate; coating a silver nanowire solution on the substrate, the surface modification layer repels the silver nanowire solution, the silver nanowire solution is automatically scattered on the surface modification layer and is gathered onto a portion of the substrate that is not covered by the surface modification layer; and performing a baking process to cure the silver nanowire solution to form the patterned silver nanowire film.

A method of manufacturing a flexible electronic circuit is provided. The method may include forming a positive photoresist mold on a flexible polymer substrate having a plurality of metal traces. The method may also include applying a conformal material coating over the positive photoresist mold, the flexible polymer substrate, and the metal traces. The method may further include removing an excess of the conformal material coating by running a blade over the positive photoresist mold. The method may also include removing the positive photoresist mold to reveal a cavity defined by the conformal material coating. The method may further include dispensing an anisotropic conductive paste into the cavity and inserting a chip into the cavity and bonding the chip to the metal traces.

A transparent conductor is provided, including a visible light transparent substrate and metal traces disposed on the substrate, and a layer of a second metal deposited on at least a portion of the metal traces. The transparent conductor further includes a layer of a second metal, which conforms to the surface structure of the metal traces on which it is deposited. Optionally, the transparent conductor also includes a coating layer disposed on a portion of the metal traces and the substrate surface. The coating layer includes a polymer prepared from a polymerizable composition containing at least one ionic liquid monomer. A method of forming a transparent conductor is also provided, including obtaining a visible light transparent substrate having metal traces disposed on the substrate and applying a coating composition on a portion of the metal traces and substrate. The coating composition contains at least one noble metal salt and at least one polymerizable ionic liquid monomer.

An electrical module and a circuit board arrangement including an electrical module are disclosed. The electrical module includes an upper side and an underside, the upper side having four rectangularly arranged side edges, an electrical component embedded in the electrical module, and at least three electrical solder pads formed on the upper side configured to make electrical contact with the electrical component and configured to come into contact with an associated electrical solder pad of a circuit board via a solder layer. The solder pads of the electrical module are arranged in a symmetrical arrangement on the upper side of the electrical module, and/or the solder pads are arranged axially symmetrically on the upper side of the electrical module, and/or the solder pads extend along two opposite side edges on the upper side of the electrical module.