A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.

An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device structures. Adhesive may be dispensed as liquid adhesive and cured to form adhesive joints. Adhesive joints may be debonded. Chain reactions may be initiated by applying a localized initiator such as a chemical or localized energy to the adhesive. Once initiated, the chain reaction may spread throughout the adhesive to cure the adhesive, to globally change adhesive viscosity, or to weaken the adhesive to facilitate debonding. Local changes to adhesive may also be made such as local increases and decreases to adhesive viscosity. Chain reaction curing may be used to cure adhesive or debond adhesive that is hidden from view within gaps in the electronic device structures. Viscosity changes may be used to control where adhesive flows.

To provide a wiring-attached adhesive substrate that can suppress the occurrence of crack and buckling in the wiring pattern formed on the adhesive layer. The wiring-attached adhesive substrate according to one aspect of the present disclosure comprises a substrate, an adhesive layer formed on the substrate, and a wiring pattern formed on the adhesive layer. The adhesive layer has an adhesive strength of 0.01 N/25 mm or more to a PET film, layer thickness variation when the adhesive layer is immersed in isopropyl alcohol for 1 minute is 20% or less, and layer thickness variation when the adhesive layer is immersed in toluene for 1 minute is 18% or less.

An electronic device is described that is designed to be more easily recycled at its end of life while maintaining usability during its lifetime. The electronic device includes a first substrate, an encapsulation layer, and a set of electronics disposed there between. One or more delamination layers cover at least one side, preferably both sides, of the set of electronics to separate the set of electronics from at least one, preferably both, of the first substrate and the encapsulation layer. The set of electronics, covered by the one or more delamination layers, is encapsulated between the encapsulation layer and the first substrate. At least one of the delamination layers includes a set of passages filled with material of the encapsulation layer forming a set of interconnections between the encapsulation layer and the first substrate.

The present disclosure relates to a conductive trace precursor composition comprising a metal salt; 3 to 15 weight % of a reducing solvent selected from a lactam and/or a polyol, and water. Where the reducing solvent is 2-pyrrolidinone, the 2-pyrrolidinone is not present in an amount of 5 weight % or in an amount of 7.5 weight % of the conductive trace precursor composition.

A printing process assistance system includes a printing part that executes a printing process of printing a paste material onto a board, and a cleaning process of cleaning a lower surface of the mask a predetermined number of cleaning times at a predetermined cleaning interval; a control part that controls an operation in each of the printing process and the cleaning process; an inspection part that inspects a level of a smudge of the paste material on the board subjected to the printing process; and an information output part that outputs, when a result of the inspection shows continual smudge occurrence, assistive information to reduce the smudge to a destination which is at least one of the control part or a notification part configured to notify an operator of information. The information output part outputs information to increase a frequency of cleaning processes as the assistive information.