Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 m in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30 C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.

A method for making a miniaturized circuit includes: depositing a bottom metal layer including a first metal on a substrate; forming a patterned photoresist layer on the bottom metal layer to expose a first portion of the bottom metal layer and to cover a second portion thereof; plating a middle circuit pattern including a second metal on the bottom metal layer to cover the first portion of the bottom metal layer; plating a top circuit pattern including a third metal different from the first metal onto the middle circuit pattern to cover the middle circuit pattern; removing the patterned photoresist layer; and etching the second portion of the bottom metal layer with an etchant, so as to pattern the bottom metal layer into a bottom circuit pattern.

This application provides a circuit board, an electronic device, and a production method for a circuit board. The circuit board includes: a board body; an electronic component, welded to a surface of the board body by using soldering tin; and a reaction particle, disposed on the surface of the board body and adjacent to a weld leg for welding the electronic component. When the circuit board is energized and in an environment with water, the reaction particle reacts with the weld leg to form an insoluble protection layer on an outer surface of the weld leg, and the insoluble protection layer isolates the weld leg from water to prevent dendrite corrosion of the weld leg.

Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 m in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30 C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.

The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.

There is provided a resin composition with which the desmear properties can be enhanced, a cured product thereof can be made low in dielectric loss tangent, and the cured product can be made high in heat resistance. The resin composition according to the present invention includes a compound having a structure represented by formula (1), a structure in which a substituent is bonded to a benzene ring in the structure represented by formula (1), a structure represented by formula (2), a structure in which a substituent is bonded to a benzene ring in the structure represented by formula (2), a structure represented by formula (3), a structure in which a substituent is bonded to a benzene ring in the structure represented by formula (3), a structure represented by formula (4), or a structure in which a substituent is bonded to a benzene ring in the structure represented by formula (4) and an active ester compound and the structure represented by the formula (1), (2), (3), or (4) has a phenylene group or a naphthylene group and a hetero atom, a group in which a hydrogen atom is bonded to a hetero atom, or a carbonyl group.

The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. Materials, modeling tools, manufacturing approaches, device designs and system level embodiments of transient electronics are provided.

The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

It is intended to provide a method for producing a printed circuit board capable of enhancing the adhesion between the inorganic filler-containing insulating layer and the conductor layer of a printed circuit board. The method for producing a printed circuit board of the present invention is a method for producing a printed circuit board, having an alkali treatment step of bringing a surface of an insulating layer for a printed circuit board into contact with an aqueous alkali solution, and a conductor layer forming step of forming a conductor layer on at least a part of the surface of the insulating layer that has undergone the alkali treatment step, wherein the insulating layer contains a resin composition containing a thermosetting resin, a silane compound having a (meth)acrylic skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

A process for the production of an entry sheet for drilling a printed wiring board material, which process comprises forming a multi-layered water-soluble resin composition layer on at least one surface of a metal foil, wherein an aqueous solution of a water-soluble resin composition is applied to the metal foil, dried and solidified to form one water-soluble resin composition layer, the application, drying and solidification of the aqueous solution of the water-soluble resin composition are repeated at least once to form at least one water-soluble resin composition layer on the above one water-soluble resin composition layer, the multi-layered water-soluble resin composition layer is composed of these water-soluble resin composition layers, the multi-layered water-soluble resin composition layer has a thickness of at least 50 m and is almost free from air bubbles, and an entry sheet for drilling a printed wiring board material obtained by the above process.