A method of producing a substrate includes: providing a ceramic substrate having a first surface and a second surface that is located opposite the first surface; irradiating a first part of the first surface with a first laser light having a first pulse width to perform ablation of the first part of the ceramic substrate; and irradiating a second part of either the first surface or the second surface with a second laser light having a second pulse width, which is longer than the first pulse width, the second part being located apart from the first part in a plan view to perform thermal processing of a third part including the first part and the second part. Upon removal of the third part and a part enclosed by the third part, an aperture that extends from the first surface to the second surface is formed in the ceramic substrate.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

A process method for laser removal of substrate solder mask by: providing a substrate with solder pads; covering the substrate and the solder pads with a solder mask, where the part of the solder mask facing the substrate is the shielding part and the part of the solder mask facing the solder pads is the clearing part; using a camera module to read the QR-code for plate production part number on the substrate; automatically importing the CAD/CAM data to the laser device, where the CAD/CAM data corresponds to the plate production part number; sequentially stripping the cleaning part through the laser beam according to the CAD/CAM data to make the solder mask form a hollow portion; taking a picture of the substrate and taking out the processed substrate picture; completing the substrate processing job if the processed substrate picture and the CAD/CAM data are the same.

The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.

A method of manufacturing a printed wiring board according to one aspect of the present disclosure is a method of manufacturing a printed wiring board from a printed wiring board sheet having a plurality of printed wiring board pieces. The method includes: determining, by an electrical inspection, whether each of the plurality of printed wiring board pieces is a non-defective product or a defective product; after the determining, selectively cutting out the non-defective product from the printed wiring board sheet; and inspecting an appearance of the non-defective product cut out in the cutting out. The method further includes passing on data about a non-defective product or a defective product to the cutting out, the data about a non-defective product or a defective product being obtained in the determining. In the cutting out, the non-defective product is cut out based on the data passed on in the passing on.

A method for manufacturing a wiring board that includes preparing a substrate including an insulating resin and a metal member having an anti-rust layer formed on a surface thereof that is arranged so as to face a second surface of the insulating resin. The method includes forming a bottomed hole by irradiating a first laser beam from a first surface side of the insulating resin. The bottomed hole penetrates the insulating resin and has an inner bottom surface that is the surface of the metal member. The method also includes removing the anti-rust layer formed on the surface of the metal member in the inner bottom surface of the bottomed hole, injecting a conductive paste into the bottomed hole and applying the conductive paste to the first surface of the insulating resin so as to have a wiring continuous with the injected conductive paste, and curing the conductive paste.