A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.

Disclosed is a copper alloy article including: a substrate 10 made of a copper alloy; a polyester-based resin body 40; and a compound layer 20 for bonding the substrate 10 and the polyester-based resin body 40, wherein the compound layer 20 contains; a compound having a nitrogen-containing functional group and a silanol group, and an alkane type amine-based silane coupling agent.

A water-based organic solderability preservative includes (A) an imidazole compound, (B) an organic acid, (C) a complex coating formation aid, (D) an organic solvent and (E) water. The component (D) (organic solvent) has a solubility to water of 10 g/100 g or more at 20 degrees C. and a boiling temperature in a range from 100 degrees C. to 300 degrees C.

An object of the invention is to provide a conductive film that can prevent an operation error caused by ion migration and is suitable for, for example, a projected capacitive touch panel, a method for manufacturing the conductive film, and a touch panel using the conductive film. In the conductive film, a resin layer is laminated on a surface of a substrate. A mesh-shaped groove portion is formed in a surface of the resin layer. A thin metal wire is provided in the groove portion to form an electrode pattern. When a value indicating ion migration characteristics of the electrode pattern in a longitudinal direction is ML and a value indicating ion migration characteristics of the electrode pattern in a lateral direction is MS, a migration ratio obtained by dividing the larger of the two values ML and MS by the smaller value is in the range of 1.0 to 1.4.

A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.

A cleaning composition includes about 0.01 to about 5 wt % of a chelating agent; about 0.01 to about 0.5 wt % of an organic acid; about 0.01 to about 1.0 wt % of an inorganic acid; about 0.01 to about 5 wt % of an alkali compound; and deionized water.

A method for selective deposition of an organic solderability preservative coating on a copper surface of an article is disclosed. The method includes two steps of organic coatings by two solutions; the first step contains contacting the copper surface with a first solution including azole compound and the second step contains contacting the copper surface treated by the first solution with a second solution including a specific pyrazine derived compound.

Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).

A method for pretreating a copper surface for the subsequent formation of a firmly adhesive bond between the copper surface and a plastic material substrate. The method comprises bringing a copper surface into contact with: a) hydrogen peroxide; b) an acid; c) a nitrogen-containing, five-membered, heterocyclic compound; and d) a lactam, amide, or polyamide, connected at one or more of its nitrogen atoms with at least one residue of formula (I),

##STR00001##

wherein: n is an integer from 1 to 100; R.sub.1 is hydrogen or a hydrocarbon residue with 1 to 6 carbon atoms; R.sub.2 is hydrogen or a hydrocarbon residue with 1 to 6 carbon atoms; and each R.sub.1 and R.sub.2 in a (CHR.sub.1CHR.sub.2O) moiety is selected independently of each R.sub.1 and R.sub.2 in another (CHR.sub.1CHR.sub.2O) moiety.

The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound () onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound () by a wet-mode plating technique, wherein the compound () is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.