Flexible lighting panel includes a substrate with a conductor pattern and apertures, solid-state light emitters electrically connected to the conductor pattern, a light-transmissive first protective layer covering at least a portion of a first surface of the substrate, and a second protective layer covering at least a portion of a second surface of the substrate. The first and second protective layers are joined to one another through the apertures and the periphery of the substrate to assist in maintaining the light-transmissive first protective layer and the second protective layer against the first and second surfaces of the substrate, respectively. One or both of the first and second protective layers encapsulate the solid-state light emitters. The lighting panel is flexible to allow opposite edges of the lighting panel to be folded over on one another and/or the lighting panel to be rolled into a tubular configuration.

In one aspect, the present disclosure relates to an electronic device comprising: a plurality of electronic chip components; a plurality of liquid metal (LM) electrical interconnects coupled to the plurality of electronic chips; and a polyimine film encapsulating the plurality of electronic chip components and the plurality of LM electrical interconnects. In some embodiments, the polyimine film comprises the product of the polymerization reaction between terephthaldehyde, 3,3diamino-N-methyldipropylamine, and tris(2-aminoethyl)amine. In another aspect, the present disclosure relates to a method for manufacturing an electronic device, the method comprising: disposing a volume of LM on a polyimine substrate to form a plurality of electrical interconnects; disposing a plurality of electronic chip components onto the polyimine substrate and in contact with the plurality of electrical interconnects; and applying a layer of polyimine onto the polyimine substrate, the plurality of electrical interconnects, and the plurality of electronic chip components.

Here are described composite panels comprising at least one integrated or embedded electrical circuit, their methods of manufacturing and their use in the aeronautic and aircraft industries. Also described are aircraft components comprising the composite panel as defined herein.

A housing assembly includes a housing, a printed circuit board (PCB) contained in a housing, and a cup-shaped cap having an interior and a flange portion. A tall component extending from the PCB is covered by the cap such that the tall component is disposed in the interior of the cap and the flange portion of the cap engages the PCB. A vacuum is applied and while maintaining the vacuum, an encapsulant is introduced into the housing to a level so as to cover the PCB and certain other components not the relatively taller component(s). When the vacuum is released, a pressure differential between the environmental pressure and the vacuum remaining in the cap interior forces encapsulant into the cap interior to a level higher than that outside of the cap. A multi-level height potting process is achieved.

A method of manufacturing a System in Package (SiP) module includes: welding required electronic units by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB for obtaining a PCB assembly (PCBA) of the SiP module; pasting tightly a functional film on a surface of the electronic units of the PCBA; filling on plastic materials on the top surface of the PCBA, ensuring that the plastic materials covers the electronic units and the functional film on the top surface of the PCBA, and obtaining solidified PCBA after the plastic materials are solidified; and cutting the solidified PCBA for obtaining a plurality of the SiP modules.

An LED display device including: a bottom case, electronic components, a circuit board, and an LED lamp group, with no mask covering above the LED lamp group. A cured resin layer is potted over the LED lamp group fixed on the circuit board, and the cured resin layer is adhered with a light-transmitting film, and the cured resin layer and the light-transmitting film together serves as a protective layer. The LED display device has advantages in adjusting and controlling the contrast, viewing angle, and color uniformity of the display device; the performance in moisture proof, windproof, rainproof, anti-corrosion, heat dissipation, and ultraviolet resistance is obviously improved, which can significantly reduce the lamp dysfunction rate and lamp collision rate of the display device, prevent the lamp bead from falling off and avoid other damage to the lamp bead, thereby making the maintenance procedure simpler.

Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern on a thermal adhesive film. One or more surface mounted device(s) are attached to a cured printed circuit to form an assembled printed circuit. The assembled printed circuit may be placed on a stretchable substrate. The thermal adhesive film is melted on the assembled printed circuit and the stretchable substrate to protect and reinforce joint bonds and the circuit pattern of the assembled circuit pattern and attach the assembled printed circuit to the stretchable fabric in one melting or curing step.

An electronic component-containing module includes a board, electronic components, and a sealing resin and includes a space provided between the board and at least one of the electronic components. The dryness factor of the sealing resin is about 60% or more where, after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of a brazing filler metal.

Disclosed is an electromagnetic shielding structure of a solid state driver (SSD), and particularly an electromagnetic shielding structure of an SSD, in which an electromagnetic shielding structure of a closed shield can type is achieved based on an electromagnetic shielding structure that employs an electromagnetic shielding coating layer electrically connected to a ground via hole formed in a printed circuit board (PCB) and a lower electromagnetic shielding layer formed inside the PCB and electrically connected to the electromagnetic shielding coating layer through the ground via hole, thereby improving electromagnetic shielding performance.