An intrinsically safe mobile device having a form factor, speed, and functionality comparable to a conventional non-intrinsically safe mobile device, includes non-intrinsically safe electronic components mounted on an unprotected part of a printed circuit board (PCB) contained within the mobile device, the non-intrinsically safe electronic components are encapsulated to reduce risk of sparking and to minimize surface heating to enable the encapsulated electronic components to be certified as intrinsically safe, wherein the encapsulated electronic components are connected using a trace with intrinsically safe electronic components mounted on a protected part of the PCB and are connected with user interface components using FPC cabling, wherein the trace and the FPC cabling are certified as intrinsically safe using one or more protection techniques chosen from a resistor, a double MOSFET clamping circuit, a capacitor, a fuse, and maintaining a minimum clearance space.

A stacked semiconductor package includes a first semiconductor package including a first circuit board and a first semiconductor device mounted on the first circuit board; a second semiconductor package including a second circuit board and a second semiconductor device mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; and a heat transfer member provided on the first semiconductor device and a part of the first circuit board, the part being around the first semiconductor device.

Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern directly on a single thermal adhesive film, placing one or more surface mounted devices on a cured deposed circuit of the deposed circuit pattern, curing the one or more surface mounted devices and the cured deposed circuit together to form an assembled deposed circuit, placing the assembled deposed circuit on a stretchable substrate, and melting the single thermal adhesive film directly onto the assembled deposed circuit and the stretchable substrate to reinforce joint bonds of the assembled deposed circuit and to attach the assembled deposed circuit to the stretchable substrate.

Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern directly on a single thermal adhesive film, placing one or more surface mounted devices on a cured deposed circuit of the deposed circuit pattern, curing the one or more surface mounted devices and the cured deposed circuit together to form an assembled deposed circuit, placing the assembled deposed circuit on a stretchable substrate, and melting the single thermal adhesive film directly onto the assembled deposed circuit and the stretchable substrate to reinforce joint bonds of the assembled deposed circuit and to attach the assembled deposed circuit to the stretchable substrate.