A package that includes a substrate and an electrical component coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, and a solder resist layer located over a surface of the at least one dielectric layer. The solder resist layer includes a first solder resist layer portion comprising a first thickness, and a second solder resist layer portion comprising a second thickness that is less than the first thickness. The electrical component is located over the second solder resist layer portion.

An electronic device module includes: a substrate; a sealing portion disposed on a first surface of the substrate; an exothermic device disposed on the first surface of the substrate and embedded in the sealing portion; and a heat radiating portion at least partially embedded in the sealing portion. A lower surface of the heat radiating portion is bonded to one surface of the exothermic device. A side surface of the heat radiating portion is curved and is entirely in contact with the sealing portion. A plurality of grooves are disposed in the side surface of the heat radiating portion.

A module includes a PCB including a substrate, a component pad and at least one wire pad, an SMT component mounted to a component pad, a wire fence, a mold compound and a top conductive layer. Each wire pad is connected to ground by a corresponding via extending through the substrate, and the wire fence includes wire loops connected to each wire pad. The mold compound is disposed over the PCB, the SMT component and the wire fence, and defines multiple holes extending partially through the mold compound to top-edges of the wire loops, respectively, where a conductive material fills the holes. The top conductive layer is disposed over the mold compound, and is in electrical contact with the conductive material filling the holes. The wire fence, the conductive material, and the top conductive layer provide shielding of the SMT component from electromagnetic radiation.

A circuit device has a base plate, a first substrate arranged on a first outer side of the base plate, a second substrate arranged on a second outer side opposite the first outer side of the base plate, at least one electrical connection element that electrically connects the first substrate and the second substrate, at least one electronic component arranged on or in the first substrate, at least one electronic component arranged on or in the second substrate, a mold package molded around the two substrates and the electronic components arranged thereon, and at least one contacting element for electrically contacting the first substrate and/or the second substrate. The at least one contacting element is electrically conductively connected to the first substrate and/or the second substrate and is led out from the mold package.

A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device.

Configurable smart object systems with methods of making modules and contactors are provided. Example systems implement machine learning based on neural networks that draw low power for use in smart phones, watches, drones, automobiles, and medical devices. Example assemblies can be configured from pluggable, interchangeable modules that have compatible ports for interconnecting and integrating functionally dissimilar sensor systems. An example method includes mounting an element of a configurable machine learning assembly on a substrate, creating at least one fold in the substrate, folding the substrate at the fold into a housing of a module of the configurable machine learning assembly, and adding a molding material to the housing to at least partially fill the module of the configurable machine learning assembly. The example module construction may also form contactors on folded edges of the module for making physical and electrical contact with other modules of the smart object machine learning assembly.

Molded circuit unit of camera module, based on molding technique, and manufacturing method thereof, includes a circuit board portion and a molding portion. The circuit board portion is electrically connected with a sensor of the camera module. The molding portion is molded to form on the circuit board portion to enclose electric elements protruded on the circuit board portion and support the camera lens of the camera module.

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

An electronic device module, includes a substrate including a grounding electrode disposed on a surface of the substrate, an insulating portion encapsulating a portion of the surface of the substrate, an electronic component disposed on the surface of the substrate, wherein the electronic component is at least partially encapsulated by the insulating portion, and a sealing portion, having electrical conductivity, disposed on the substrate and the insulating portion. The sealing portion is electrically connected to the grounding electrode.