Protective coatings, including moisture-resistant coatings, that include two or more different types of moisture-resistant materials are disclosed, as are moisture-sensitive substrates that include such protective coatings. Moisture-sensitive substrates that include different types of moisture-resistant coatings on different elements are also disclosed.

A method for fabricating an electronic device package includes providing a carrier, disposing a semiconductor chip onto the carrier, the semiconductor chip having a contact pad on a main face thereof remote from the carrier, applying a contact element onto the contact pad, applying a dielectric layer on the carrier, the semiconductor chip, and the contact element, and applying an encapsulant onto the dielectric layer.

The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

The present invention relates to an electrical assembly which has a conformal coating, wherein said conformal coating is obtainable by a method which comprises: (a) plasma polymerization of a compound of formula (I) and a fluorohydrocarbon, wherein the molar ratio of the compound of formula (I) to the fluorohydrocarbon is from 5:95 to 50:50, and deposition of the resulting polymer onto at least one surface of the electrical assembly: wherein: R.sub.1 represents C.sub.1-C.sub.3 alkyl or C.sub.2-C.sub.3 alkenyl; R.sub.2 represents hydrogen, C.sub.1-C.sub.3 alkyl or C.sub.2-C.sub.3 alkenyl; R.sub.3 represents hydrogen, C.sub.1-C.sub.3 alkyl or C.sub.2-C.sub.3 alkenyl; R.sub.4 represents hydrogen, C.sub.1-C.sub.3 alkyl or C.sub.2-C.sub.3 alkenyl; R.sub.5 represents hydrogen, C.sub.1-C.sub.3 alkyl or C.sub.2-C.sub.3 alkenyl; and R.sub.6 represents hydrogen, C.sub.1-C.sub.3 alkyl or C.sub.2-C.sub.3 alkenyl, and (b) plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the polymer formed in step (a).

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A first resin layer (1) has: a covered region which is covered by a second resin layer (2) and an exposed region (1a); a contact part (1b) which is provided in the exposed region (1a); and a bend part (1c) which is provided between (a) a boundary between the covered region and the exposed region (1a) and (b) the contact part (1b).

The present disclosure relates to a smart textile product and a method for manufacturing a smart textile product. The smart textile product is provided with a flexible and/or stretchable textile fabric (10) comprising a plurality of electrically conductive threads (11, 12) and at least one rigid electronic or optoelectronic component (20) comprising at least one electrically conductive pad (21, 22), which is in electrical contact with at least one of the plurality of electrically conductive threads. The smart textile product (10) comprises an elastomeric encapsulation layer (31) in which the electrical connection (1, 2) is embedded, so as to provide a gradual transition in deformability between the flexible and/or stretchable textile fabric (10) and the at least one rigid component (20) at the location of the at least one electrical connection (1, 2).

A high-frequency module (100) includes a multilayer board (110) including a plurality of insulator layers and at least one ground conductor layer (113); in the multilayer board (110), a transmission circuit (120) that is a first circuit provided in a first region and an antenna circuit (130) that is a second circuit provided in a second region different from the first region; and shielding conductor films (151 to 156) provided on sides of the multilayer board (110) and being partially in contact with the ground conductor layer (113). The ground conductor layer (113) is not in contact with the shielding conductor films (151 to 156) in, of a side of the multilayer board (110), a portion that is closest both to the first region and to the second region.

Audio device, electronic circuit, and related methods, in particular a method of manufacturing an electronic circuit for an audio device is disclosed, the method comprising providing a circuit board; mounting one or more electronic components including a first electronic component on the circuit board; applying a first insulation layer outside the first electronic component; and applying a first shielding layer outside the first insulation layer.

An encapsulated assembly of electronic componentry, suitable for incorporation into a textile or a yarn, and the assembly comprising two flexible substrates (3, 4) which encapsulate the electronic componentry, at least one of the flexible substrates comprising at least one preformed relief region (3a), which provides a volume which at least in part accommodates the electronic componentry, and the componentry located substantially at a neutral axis (N) of the assembly.

A capacitive level sensor device, for detecting the level of a medium contained in a container, comprises a circuit support, which extends longitudinally substantially according to level-detection axis. The circuit support has, in a detection region thereof, at least one first plurality of first capacitive elements, which comprise at least one first array of first electrodes (J), preferably spaced from one another along the level-detection axis, which are arranged in a position corresponding to at least one first side of the circuit support. The sensor device has a casing body which comprises an electrically insulating and fluid-tight detection portion, which covers the detection region of the circuit support. The detection portion of the casing body comprises an overmoulded outer coating, made of a first electrically insulating polymeric material, which defines an outer surface of the casing body designed to be in contact with the medium the level of which has to be detected. The first electrodes (J) are enclosed within the supporting structure of the circuit support at least at the detection region thereof, and, at least at the detection region, between the overmoulded outer coating and the supporting structure of the circuit support there is set at least one intermediate layer made of an electrically insulating material different from the first material.