The electronic circuit device according to the present invention including the wiring layer 13 including a plurality of the metal wirings, the photosensitive resin layer 21 made of the photosensitive resin arranged on the wiring layer 13, and the first electronic circuit element 33 arranged in the photosensitive resin layer 21. In this electronic circuit device, a plurality of opening 41 for exposing a part of the wiring layer 13 is formed on the photosensitive resin layer 21, and further, together with three-dimensionally connected to the first electronic circuit element 33, the re-distribution layer 42 on the first electronic circuit element including a plurality of the metal wirings which is three-dimensionally connected via a plurality of openings to a part of the wiring layer 13, and the first external connection terminal 51 connected to the re-distribution layer 42 are formed.

A method of manufacturing a component carrier includes providing a core structure with at least one electrically insulating layer structure with a through hole, closing the through hole by a resin layer, and attaching a component in the through hole to the resin layer. The component is fixed to the core structure by curing the resin layer.

One aspect relates to a process for producing an electrical medical implant, comprising the following steps: a. providing an electrical feedthrough, which comprises a substrate, an electrical component, and a contact element; b. coating the electrical component with a layer.

A system for a wearable circuit is described. The system includes a soft substrate. The system include a first battery assembly attached to the soft substrate. The system includes a second battery assembly attached to the soft substrate. The system includes a flexible connecting device. A flexible connecting device is configured to connect a first battery assembly to a second battery assembly and stretch along a path of a soft substrate. A flexible connecting device provides an electrical connection between a first and second battery assembly while being stretched.

A method includes forming, by atomic layer deposition, a first barrier layer on a surface of a printed circuit board (“PCB”) and on an outer surface of an electrical component attached to the surface of the PCB; forming an adhesion promotion layer on a surface of the first barrier layer; and forming, on the adhesion promotion layer, a second barrier layer including Parylene.

A method for depositing a protective coating onto a substrate, wherein the protective coating comprises (i) a moisture-barrier layer which is in contact with the substrate and which comprises a first sub-layer, optionally one or more intermediate sub-layers, and a final sub-layer, (ii) a mechanical-protective layer which is inorganic, and (iii) a gradient layer interposing the moisture-barrier layer and the mechanical-protective layer.

An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.

A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.

A method comprises: providing a circuit board comprising a first surface, an opposing second surface, and a ground connection; defining a shielding zone and a non-shielding zone on the first surface, one or more shielding-zone electronic components being comprised within the shielding zone; providing a groove in the circuit board, the groove extending along at least part of the shielding zone and being in-between the shielding zone and the non-shielding zone; applying an insulating encapsulation layer to cover the shielding zone, whereby the one or more shielding-zone electronic components are encapsulated; applying an electrically conductive shielding layer on top of at least part of the encapsulation layer and to the ground connection so as to electrically couple the shielding layer to the ground connection, whereby the one or more shielding-zone electronic components are electromagnetically shielded. Further, disclosed is a circuit board, and a hearing device comprising a circuit board.

Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.