A method of manufacturing a System in Package (SiP) module includes: welding required electronic units by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB for obtaining a PCB assembly (PCBA) of the SiP module; pasting tightly a functional film on a surface of the electronic units of the PCBA; filling on plastic materials on the top surface of the PCBA, ensuring that the plastic materials covers the electronic units and the functional film on the top surface of the PCBA, and obtaining solidified PCBA after the plastic materials are solidified; and cutting the solidified PCBA for obtaining a plurality of the SiP modules.

A capacitive level sensor device, for detecting the level of a medium contained in a container, comprises a circuit support, which extends longitudinally substantially according to level-detection axis.

The circuit support has, in a detection region thereof, at least one first plurality of first capacitive elements, which comprise at least one first array of first electrodes (J), preferably spaced from one another along the level-detection axis, which are arranged in a position corresponding to at least one first side of the circuit support.

The sensor device has a casing body which comprises an electrically insulating and fluid-tight detection portion, which covers the detection region of the circuit support. The detection portion of the casing body comprises an overmoulded outer coating, made of a first electrically insulating polymeric material, which defines an outer surface of the casing body designed to be in contact with the medium the level of which has to be detected.

The first electrodes (J) are enclosed within the supporting structure of the circuit support at least at the detection region thereof, and, at least at the detection region, between the overmoulded outer coating and the supporting structure of the circuit support there is set at least one intermediate layer made of an electrically insulating material different from the first material.

An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.

An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.

An electronic component-containing module includes a board, electronic components, and a sealing resin and includes a space provided between the board and at least one of the electronic components. The dryness factor of the sealing resin is about 60% or more where, after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of a brazing filler metal.

A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.

A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.

A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.

In a circuit forming device, resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into cavity of the resin laminated body, and electronic component is placed on ultraviolet curable resin. Then, electronic component is cured and electronic component is fixed. In addition, since the ultraviolet curable resin is cured by only irradiating the ultraviolet curable resin with ultraviolet rays, it is possible to reduce the time required for fixing the component. In addition, by causing the ejection amount of the ultraviolet curable resin for fixing the component to correspond with at least one of the size and the weight of the electronic component, it is possible to properly mount the component at a planned mounting position by a self-alignment effect.

An ECU 1 includes a circuit board 10, a connector 20 fixed to the circuit board 10, a resin portion 50 covering the circuit board 10 and the connector 20. A buffer portion 60 is interposed between the circuit board 10 and the connector 20, between the circuit board 10 and the resin portion 50, or between the connector 20 and the resin portion 50. This configuration enables the buffer portion 60 having elasticity to absorb the stresses generated due to differences in linear expansion coefficient in the boundary portion between the circuit board 10 and the connector 20, the boundary portion between the circuit board 10 and the resin portion 50, and the boundary portion between the connector 20 and the resin portion 50. This makes it possible to prevent the connector 20 from peeling from the circuit board 10.