A method for treating a substrate having millimeter and/or micrometer and/or nanometer structures. The method includes applying at least one protective material to the structures, wherein the at least one protective material can be dissolved in a solvent, and the structures are produced by an imprinting process.

A method of forming an article, comprising: forming an adhesion layer comprising MnO.sub.x on a glass, glass-ceramic or ceramic wafer; calcining the adhesion layer such that a first portion of the MnO.sub.x of the adhesion layer is chemically bonded to the wafer; depositing a metal layer on the adhesion layer; and processing the metal layer and the adhesion layer such that a portion of the MnO.sub.x of the adhesion layer is chemically bonded to the metal layer.

According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 m at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 m at the second major surface and fully fills the via between the first cavity and the second cavity.

Provided herein is a method to printed electronics, and more particularly related to printed electronics on flexible, porous substrates. The method includes applying a coating compound comprising poly (4-vinylpyridine) (P4VP) and SU-8 dissolved in an organic alcohol solution to one or more surface of a flexible, porous substrate, curing the porous substrate at a temperature of at least 130 C. such that the porous substrate is coated with a layer of said coating compound, printing a jet of a transition metal salt catalyst solution onto one or more printing sides of the flexible, porous substrate to deposit a transition metal salt catalyst onto the one or more printing sides, and submerging the substrate in an electroless metal deposition solution to deposit the metal on the flexible, porous substrate, wherein the deposited metal induces the formation of one or more three-dimensional metal-fiber conductive structures within the flexible, porous substrate.

A processing machine can include motors; at least one heater; first and second processing enclosures separated by a gap; an upper level conveyor that passes circuit assemblies through the first and second processing enclosures and the gap; a lower level conveyor that passes the circuit assemblies through the first and second processing enclosures and the gap; an elevator that transports the circuit assemblies between the upper level conveyor and the lower level conveyor; and a controller that includes circuitry operatively coupled to the motors and to the at least one heater.

An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.010.sup.8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of 40 C. and heating the article to a temperature of 125 C., and the article has a helium hermeticity of less than or equal to 1.010.sup.8 atm-cc/s after 100 hours of HAST at a temperature of 130 C. and a relative humidity of 85%.

A processing machine can include motors; at least one heater; first and second processing enclosures separated by a gap; an upper level conveyor that passes circuit assemblies through the first and second processing enclosures and the gap; a lower level conveyor that passes the circuit assemblies through the first and second processing enclosures and the gap; an elevator that transports the circuit assemblies between the upper level conveyor and the lower level conveyor; and a controller that includes circuitry operatively coupled to the motors and to the at least one heater.

Provided is a method for fabricating a strain-pressure complex sensor and a sensor fabricated thereby. This method includes coating a fabric with a graphene oxide; reducing the graphene oxide coated with the fabric to form a graphene; disposing carbon nanotubes on the fabric coated with the graphene; and connecting an electrode to the fabric.

A method of potting e.g. a stack of printed circuit boards, the method comprising applying a first potting material to selected regions of the circuit to be potted and then applying a second, different, potting material over the circuit to be potted.

A unit can include a power supply interface; a processor board power interface operatively coupled to the power supply interface where the processor board power interface operatively couples to and supplies power to a processor board; a serial interface that operatively couples to the processor board; a microcontroller operatively coupled to the serial interface; memory operatively coupled to the microcontroller; a motor control interface operatively coupled to the microcontroller; an optically isolated digital input interface operatively coupled to the microcontroller; a digital output interface operatively coupled to the microcontroller; and instructions stored in the memory and executable by the microcontroller to instruct the unit to receive digital input via the optically isolated digital input interface from a machine and to output motor control signals via the motor control interface to at least one motor of the machine.