Such a pattern formation method includes a laminating step of laminating a curable resin layer 3 and a support film 4 on a substrate 2, a curing step of curing the entire curable resin layer 3, a peeling step of peeling the support film 4 from the curable resin layer 3 after curing, a processing step of irradiating the curable resin layer 3 after peeling the support film 4 with an excimer laser light 15 via a mask 14 to process the curable resin layer 3 into a predetermined pattern, and a forming step of removing the curable resin layer 3 after forming a plating layer 17 using the curable resin layer 3 with the predetermined pattern as a mask to form a wiring pattern 16 using the plating layer 17 on the substrate 2.