Patent classifications
H
H05
H05K
2203/00
H05K2203/13
H05K2203/1377
H05K2203/1394
H05K2203/1394
SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOARD INSULATION
A circuit board system includes a printed circuit board (PCB) having a first side and a second side opposite the first side. A plurality of plated through holes (PTHs) are defined through the PCB from the first side to the second side. A respective pad is defined at each end of each PTH of the plurality of PTHs. The PCB includes circuit traces electrically interconnecting among the plurality of PTHs for forming PCB circuitry. A coverlay is adhered with an adhesive layer to the first side of the PCB for insulating voltages among the plurality of PTHs.