A method for producing electronic devices includes fixing a die that includes an electronic component with integral contacts to a dielectric substrate. After fixing the die, a conductive trace is printed over both the dielectric substrate and at least one of the integral contacts, so as to create an ohmic connection between the conductive trace on the substrate and the electronic component.

A circuit board structure includes a circuit layer structure, an electronic component, and a stopper. The circuit layer structure includes a plurality of dielectric layers and circuits in the dielectric layers. The electronic component is disposed in the circuit layer structure; the electronic component includes a chip and a conductive bump; the chip has a first surface and a second surface that are oppositely disposed, and the first surface of the chip contacts one of the dielectric layers; the conductive bump is on the second surface of the chip and is electrically connected to the chip. The stopper is within the circuit layer structure and abuts against the conductive bump. A method for fabricating a circuit board structure is also provided herein.

Provided are an electronic device and a manufacturing method therefor such that, when connecting a first electronic component configured to have a step difference near an external connection terminal to a second electronic component via wiring, the size increase of a manufacturing device can be avoided, wiring can be carried out at a low-cost, and the reliability of the wiring connections can be improved. An LCD (10) and an IC (20) are embedded and exposed in a resin molding (30) in such a manner that a connection electrode (13a) of the LCD (10) and an electrode of the IC (20) are positioned on the same plane.

A printed circuit board (PCB) including an embedded electronic component is provided. The printed circuit board includes a core having a cavity, an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces, insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity, and an external circuit pattern provided on the insulating layers.

An electronic device includes electronic components, a molded resin element wherein the electronic components are embedded and secured, and a heat transfer layer; the heat transfer layer has a higher thermal conductivity than the molded resin element. The heat transfer layer is in contact with portions of the electronic components other than an electrode pad and a terminal. This prevents increases in the cost of manufacturing the electronic device and the allows the electronic device to be thinner.

In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

This document discusses, among other things, systems and methods related to a flexible circuit buzzer apparatus, such as a buzzer apparatus for use in an implantable medical device. In an example, the buzzer apparatus can include a flexible circuit having a first dielectric layer. A conductive layer can be disposed on the first dielectric layer. A hole can be formed in the first dielectric layer, the conductive layer, or both. A buzzer including a first contact can be located proximate to the hole. A conductive via can be plated or deposited in the hole. At least the first contact can be electrically coupled to the conductive layer by the conductive via.

An electronic component-embedded substrate of the present disclosure includes a core structure including an insulating layer, a first wiring layer disposed on an upper surface of the insulating layer and a through-portion passing through the insulating layer; a first electronic component disposed in the through-portion and including a connection electrode; an insulator disposed in a portion of the through-portion between the core structure and a portion of the first electronic component; and a first metal layer disposed on an upper surface of the insulator. At least a portion of the first metal layer is included on the first wiring layer and physically in contact with at least a portion of the connection electrode.

There is provided an electrical arrangement (100), comprising at least one electrical unit (110), which in its turn comprises electrical element(s) (120) with electrical contact point(s) (130a, 130b) and electrically conductive track(s) (140a, 140b) arranged in contact with the electrical contact point(s) of the electrical element(s). The electrical arrangement further comprises a substrate (145), N for supporting the electrical unit, and component(s) (120) for connecting portions of the substrate. The material of the component(s) is resizable upon processing of the material, such that, upon processing of the component(s), at least one of the electrical element(s) and the electrically conductive track(s) of the electrical unit(s) are squeezed at the respective electrical contact point by the first and second portions of the substrate biased by the force from the component(s).

Electromagnetic shields for electronic devices, and particularly electromagnetic shields with bonding wires for sub-modules of electronic devices are disclosed. Electronic modules are disclosed that include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged on or over the sub-modules. Bonding wires are disclosed that form one or more bonding wire walls along the substrate. The one or more bonding wire walls may be located between sub-modules of a module and about peripheral boundaries of the module. The electromagnetic shield may be electrically coupled to ground by way of the one or more bonding wire walls. Portions of the electromagnetic shield and the one or more bonding wire walls may form divider walls that are configured to reduce electromagnetic interference between the sub-modules or from external sources.