Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

A device embedded substrate provided with first and second connecting terminals on different surfaces, the substrate including: an electrically conductive metal block having one surface connected to the first connecting terminal, and having a dimension in a lateral direction larger than that of the electronic device; an intermediate connecting portion juxtaposed to the electronic device, including first insulation layer and wiring layers, whereby the first wiring layer is connected to the one surface of the metal block via a first conductive via; a second insulation layer which accommodates the metal block; and a third insulation layer stacked on the second insulation layer to embed the electronic device and whereon a second wiring layer is stacked, wherein the second wiring layer is connected to the first wiring layer via a second conductive via and connected to the second connecting terminal of the electronic device via a third conductive via.

A battery embedded structure is disclosed. The battery embedded structure comprises a substrate including one or more stacked battery units. Each stacked battery unit includes two or more conductive layers and one or more unit cells. Each unit cell is disposed between two conductive layers. The substrate has a principal surface provided by one or more respective side surfaces of the one or more stacked battery units. The battery embedded structure also comprises a wiring layer disposed on the principal surface of the substrate. The wiring layer includes a plurality of electrical paths and a plurality of vias. Each via is connected with one electrical path. Each via is located at a position corresponding to an edge surface of a conductive layer of the two or more conductive layers of the one or more stacked battery units so as to contact electrically to that conductive layer.

In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

A circuit board including an electronic device and a manufacturing method of the circuit board are provided. The manufacturing method includes: providing a stainless steel base material including a first surface and a second surface opposite to each other, at least one first cavity located at the first surface and at least one second cavity located at the second surface; respectively forming a first and a second metal layers on the stainless steel base material; respectively disposing at least one first and at least one second electronic devices in the first and the second cavities; respectively forming a first and a second insulating layers on the first and the second surfaces; respectively forming a first and a second circuit structures on the first and the second insulating layers, separating the stainless steel base material, the first and the second metal layers to form two separate circuit substrates including electronic devices.

The present invention relates to the field of electronic technologies, and discloses a base board and a mobile terminal. The base board includes an electrical pattern and multiple components, the base board further includes a resin layer and a thin resin layer, the component is embedded in the resin layer, and an end face of a foot is flush to a surface of the resin layer; and the thin resin layer is attached to one exposed side of a foot of a component in the resin layer, a through hole corresponding to each foot is disposed in the thin resin layer, the circuit pattern is attached to one side that is of the thin resin layer and that is opposite to the resin layer, and the circuit pattern is connected to a pad that is electrically connected to a foot and that stretches into each through hole.

A camera module is provided, including a lens driving mechanism, a lens unit, a circuit board, and an image sensor. The lens unit is disposed on the lens driving mechanism. The image sensor is disposed on the circuit board. The circuit board includes a metal member, an insulation layer, and a metal wire. The insulation layer is disposed between the metal member and the metal wire, and the metal wire is electrically connected to the image sensor. The lens driving module can drive the lens unit to move relative to the image sensor. The image sensor can catch the light through the lens unit.

A method of manufacturing a component carrier includes providing a base structure having a main surface that is at least partially covered by a component fixation structure; providing a component, the component intrinsically comprising warpage; mounting the component on a surface provided on a plate structure and/or on the base structure to remove the warpage of the component at least partially; and fixating the component to the component carrier through the component fixation structure.

A component embedded package carrier includes a core layer, at least one electronic component, a first insulating layer, a second insulating layer, a third patterned conductive layer, a fourth patterned conductive layer, a plurality of conductive blind via structures, a first protecting layer and a second protecting layer. The electronic component is disposed inside an opening of the core layer. The first and second insulating layers completely fill the opening and completely encapsulate the electronic component. The conductive blind via structures connect the third and fourth patterned conductive layers with a plurality of conductive through hole structures of the core layer, and connect the third and fourth patterned conductive layers with the electronic component. The first protecting layer covers the third patterned conductive layer and has a first roughness surface. The second protecting layer covers the fourth patterned conductive layer and has a second roughness surface.

There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.