An electronic component (11) is embedded in an end portion of a surface (P1) and an end portion of a surface (P2) adjacent to each other in a three-dimensional base (2). The portion of an electrode (21) exposed from the surface (P1) and an electrode (101) of a packaged IC (41) are connected to each other via a wiring line (201). The portion of the electrode (21) exposed from the surface (P2) and an electrode (25) of an electronic component (15) are connected to each other via a wiring line (202). Accordingly, it is possible to realize a three-dimensional circuit structure requiring no wiring line spanning over or along an end portion thereof.

Provided are an electronic device and a manufacturing method therefor such that, when connecting a first electronic component configured to have a step difference near an external connection terminal to a second electronic component via wiring, the size increase of a manufacturing device can be avoided, wiring can be carried out at a low-cost, and the reliability of the wiring connections can be improved. An LCD (10) and an IC (20) are embedded and exposed in a resin molding (30) in such a manner that a connection electrode (13a) of the LCD (10) and an electrode of the IC (20) are positioned on the same plane.

A wiring board includes a first wiring layer, an insulating layer, and a pad. The insulating layer is formed on the first wiring layer. The pad is formed on the insulating layer in a region where the insulating layer overlaps the first wiring layer in a plan view. The pad includes a pad body and plural protrusion portions. The protrusion portions protrude from the pad body toward a lower side of the pad body. The protrusion portions are embedded in the insulating layer. The protrusion portions are separate from the first wiring layer.

An auxiliary structure for embedding a component in a component carrier is disclosed. The auxiliary structure has a solid state transition piece for at least partially, in particular substantially fully circumferentially, enclosing the component, wherein the solid-state transition piece consists of a material being or becoming adhesive in a liquid state and being liquefiable by heat and/or pressure so as to fill a gap between the component and surrounding component carrier material by applying heat and/or pressure.

Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.

An integrated circuit assembly may be fabricated having an electronic substrate, an integrated circuit device having a first surface, an opposing second surface, at least one side extending between the first surface and the second surface, and at least one through-substrate via extending into the integrated circuit device from the second surface, wherein the first surface of the integrated circuit device is electrically attached to the electronic substrate; and at least one power delivery route electrically attached to the second surface of the integrated circuit device and to the electronic substrate, wherein the at least one power delivery route is conformal to the side of the integrated circuit device and the first surface of the electronic substrate.

A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second main surface opposite to the first main surface. The carrier has a recess pattern formed in the first main surface. A first semiconductor chip is attached on one of the first and second main surface. A first insulating layer overlying the main surface of the carrier on which the first semiconductor chip is attached and the first semiconductor chip is formed. The carrier is then separated into a plurality of parts along the recess pattern.

This document discusses, among other things, systems and methods related to a flexible circuit buzzer apparatus, such as a buzzer apparatus for use in an implantable medical device. In an example, the buzzer apparatus can include a flexible circuit having a first dielectric layer. A conductive layer can be disposed on the first dielectric layer. A hole can be formed in the first dielectric layer, the conductive layer, or both. A buzzer including a first contact can be located proximate to the hole. A conductive via can be plated or deposited in the hole. At least the first contact can be electrically coupled to the conductive layer by the conductive via.

Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces; insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity; and an external circuit pattern provided on the insulating layers.

Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.