There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.

A method for manufacturing a multilayer circuit board includes providing an inner circuit substrate defining a through hole, attaching a support plate to the inner circuit substrate to seal an opening of the through hole; placing an electronic module in the through hole; pressing a first substrate onto a surface of the inner circuit substrate; removing the support plate; pressing a second substrate onto another surface of the inner circuit substrate, the first substrate and the second substrate infilling the through hole and jointly encapsulating the electronic module; forming a first conductive wiring layer on a surface of the first substrate facing away from the first surface to obtain a first circuit substrate, and forming a second conductive wiring layer on a surface of the second substrate facing away from the second surface to obtain a second circuit substrate. A multilayer circuit board is also disclosed.

Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.

There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.

A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.

An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

A dielectric film may be exposed to an acid solution such as hydrochloric acid, nitric acid, or sulfuric acid during a wet process after film formation. The inventors have newly found that when a dielectric film includes Zr having a lower ionization tendency than Ti in a main component of a metal oxide expressed by a general formula (Ba, Ca)(Ti, Zr)O.sub.3 is provided and satisfies at least one between relationships such that degree of orientation of (100) plane is higher than degree of orientation of (110) plane, and degree of orientation of (111) plane is higher than degree of orientation of (110) plane in a film thickness direction, the dielectric film is less likely to be damaged during a wet process, and the resistance to a wet process is improved.

This application provides an embedded packaging structure, a preparation method thereof, and a terminal device. The embedded packaging structure includes a substrate frame, and a first through hole and a second through hole that run through the substrate frame in a thickness direction of the substrate frame. A metal connection electrode is disposed in the first through hole, an electronic component is embedded in the second through hole, and a pin of the electronic component is exposed at a hole opening of the second through hole. The substrate frame is made of silicon or a ceramic. Compared with a prior art substrate frame formed by using a resin material, the substrate frame in this application has better heat dissipation performance, moisture resistance, and strength in addition to providing insulation.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.

An embedded component structure includes a board, an electronic component, and a dielectric material layer. The board has a through cavity. The board includes an insulating core layer and a conductive member. The insulating core layer has a first surface and a second surface opposite thereto. The through cavity penetrates the insulating core layer. The conductive member extends from a portion of the first surface along a portion of the side wall of the through cavity to a portion of the second surface. The electronic component includes an electrode. The electronic component is disposed in the through cavity. The dielectric material layer is at least filled in the through cavity. The connection circuit layer covers and contacts the conductive member and the electrode. A manufacturing method of an embedded component structure is also provided.