A preparation method of a capacitor array structure includes: providing a capacitor substrate which comprises an upper electrode filling layer; forming an insulating layer on a side face of the upper electrode filling layer; forming an upper electrode metal layer on an upper surface of the upper electrode filling layer; forming a planarization layer on an outer surface of the upper electrode metal layer; and forming a first conductor which is connected to the upper electrode metal layer after running through the planarization layer as well as a second conductor which is connected to a lower circuit after running through the planarization layer, the insulating layer and an isolation layer.

Embodiments herein describe techniques for a semiconductor device having an interconnect structure including an inter-level dielectric (ILD) layer between a first layer and a second layer of the interconnect structure. The interconnect structure further includes a separation layer within the ILD layer. The ILD layer includes a first area with a first height to extend from a first surface of the ILD layer to a second surface of the ILD layer. The ILD layer further includes a second area with a second height to extend from the first surface of the ILD layer to a surface of the separation layer, where the first height is larger than the second height. Other embodiments may be described and/or claimed.

Systems, methods, and apparatuses are provided for self-aligned etch back for vertical three dimensional (3D) memory. One example method includes depositing layers of a first dielectric material, a semiconductor material, and a second dielectric material to form a vertical stack, forming first vertical openings to form elongated vertical, pillar columns with first vertical sidewalls in the vertical stack, and forming second vertical openings through the vertical stack to expose second vertical sidewalls. Further, the example method includes removing portions of the semiconductor material to form first horizontal openings and depositing a fill in the first horizontal openings. The method can further include forming third vertical openings to expose third vertical sidewalls in the vertical stack and selectively removing the fill material to form a plurality of second horizontal openings in which to form horizontally oriented storage nodes.

A capacitor structure is provided, which includes a contact layer, an insulating layer, a bottom conductive plate, a dielectric layer and a top conductive plate. The contact layer has first, second, third, fourth and fifth portions arranged from periphery to center. The insulating layer is disposed over the contact layer and has an opening exposing the contact layer. The bottom conductive plate is disposed in the opening and including first, second and third portions extending along a depth direction of the opening and separated from each other and in contact with the first, third and fifth portions of the contact layer, respectively. The dielectric layer is conformally disposed on the bottom conductive plate and in contact with the second and fourth portions of the contact layer. The top conductive plate is disposed on the dielectric layer. A method of manufacturing the capacitor is also provided.

A semiconductor memory device including a substrate; a semiconductor pattern extending in a first horizontal direction on the substrate; bit lines extending in a second horizontal direction on the substrate perpendicular to the first horizontal direction, the bit lines being at a first end of the semiconductor pattern; word lines extending in a vertical direction on the substrate at a side of the semiconductor pattern; a capacitor structure on a second end of the semiconductor pattern opposite to the first end in the first horizontal direction, the capacitor structure including a lower electrode connected to the semiconductor pattern, an upper electrode spaced apart from the lower electrode, and a capacitor dielectric layer between the lower electrode and the upper electrode; and a capacitor contact layer between the second end of the semiconductor pattern and the lower electrode and including a pair of convex surfaces in contact with the semiconductor pattern.

An integrated circuit device includes: a substrate including a plurality of active regions; a bit line extending on the substrate in a horizontal direction; a direct contact connected between a first active region selected among the plurality of active regions and the bit line; an inner oxide layer contacting a sidewall of the direct contact; and a carbon-containing oxide layer nonlinearly extending on a sidewall of the bit line in a vertical direction, the carbon-containing oxide layer contacting the sidewall of the bit line.

The present disclosure provides a method for manufacturing a semiconductor structure. The method includes providing a substrate having a first top surface; forming an isolation region in the substrate to surround an active region; forming a recess in the active region; disposing a first conductive material within the recess to form a buried power line and a buried signal line; forming a first circuit layer and a second circuit layer on the first top surface of the substrate, wherein the first circuit layer covers the buried power line and the buried signal line, and the second circuit layer is separated from the first circuit layer; and forming a cell capacitor over the first circuit layer.

The present disclosure provides a semiconductor device structure with conductive plugs of different aspect ratios and manganese-containing lining layer and a method for preparing the same. The semiconductor device structure includes a substrate having a pattern-dense region and a pattern-loose region; a first conductive layer disposed over the substrate; a first dielectric layer disposed over the first conductive layer; a first conductive plug and a second conductive plug disposed in the first dielectric layer; wherein the first conductive plug and the second conductive plug comprises copper (Cu) and are separated from the first dielectric layer by the a first lining layer comprising manganese (Mn); wherein the first conductive plug and the second conductive plug have different aspect ratios.

A memory cell includes a transistor, a storage node contact and a capacitor that are connected sequentially, wherein the capacitor includes a lower electrode, an upper electrode and a dielectric layer disposed between the lower electrode and the upper electrode. The lower electrode includes: a first electrode layer having a first sub-electrode region and a plurality of second sub-electrode regions connected to the first sub-electrode region, where the first sub-electrode region is in contact with a surface of the storage node contact, each of the second sub-electrode regions extends along a direction away from the storage node contact and has a first end face and a second end face facing each other in an extension direction, the first end face being in contact with the surface of the storage node contact; and a second electrode layer, covering at least part of a surface of the first electrode layer.

A semiconductor memory device includes a substrate including a first region and a second region arranged in a first direction, and first electrodes arranged in a second direction. The first electrodes each include a pair of first parts disposed in the first region and arranged in a third direction, and a second part disposed in the second region and electrically connected to the first parts. The device includes first wirings arranged along one of the first parts, first semiconductor layers opposed to the one of the first parts and connected to the first wirings, first memory portions electrically connected to the first wirings via the first semiconductor layers, second wirings arranged along the other of the first parts, second semiconductor layers opposed to the other of the first parts and connected to the second wirings, and second memory portions electrically connected to the second wirings via the second semiconductor layers.