A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.

An organic light emitting display apparatus includes a base layer, a circuit element layer, a display element layer, an encapsulation layer, and a sealing member. The circuit element layer includes a power supply line on the base layer and an auxiliary power supply pattern on and connected to the power supply line. The display element layer includes a first electrode, a light emitting layer, and a second electrode, which are sequentially stacked on the circuit element layer. The second electrode is electrically connected to the auxiliary power supply pattern. The sealing member is between the circuit element layer and the encapsulation layer to overlap with the auxiliary power supply pattern when viewed in a plan view.

A display module includes a window including a base substrate and a bezel pattern overlapping the base substrate in a plan view, and a display panel. The bezel pattern includes a first bezel pattern extending along an edge of the base substrate, and a second bezel pattern which extends from the first bezel pattern and of which at least a portion defines a transmission area. The display panel includes a glass substrate, an encapsulation substrate on the glass substrate, a sealing member coupling the glass substrate and the encapsulation substrate and overlapping the first bezel pattern in the plan view, a circuit element layer disposed on the glass substrate and including a transistor, and a display element layer disposed on the circuit element layer and including light emitting elements. The display element layer exposes a portion of a layer disposed thereunder, which corresponds to the transmission area.

A high-yield fabricating method of a semiconductor device including a peeling step is provided. A peeling method includes a step of stacking and forming a first material layer and a second material layer over a substrate and a step of separating the first material layer and the second material layer from each other. The second material layer is formed over the substrate with the first material layer therebetween. The first material layer includes a first compound layer in contact with the second material layer and a second compound layer positioned closer to the substrate side than the first compound layer is. The first compound layer has the highest oxygen content among the layers included in the first material layer. The second compound layer has the highest nitrogen content among the layers included in the first material layer. The second material layer includes a resin. In the step of separating, the first material layer and the second material layer are separated from each other by irradiation of an interface between the first material layer and the second material layer or the vicinity of the interface with light.

An OLED display device including: a substrate including a display area and a non-display area; an organic light emitting element including a first electrode, an organic light emitting layer on the first electrode, and a second electrode on the organic light emitting layer; a first conductive line at the non-display area of the substrate; a first organic layer on the first conductive line; a second conductive line on the first organic layer and connected to the first conductive line; a second organic layer on the second conductive line; and a third conductive line on the second organic layer and connected to the second conductive line. The third conductive line is connected to the second electrode. The first electrode is at the display area of the substrate.

A display substrate and a manufacturing method thereof. The display substrate includes a display region, a barrier region and an opening region, the barrier region is located between the display region and the opening region. The barrier region includes a first barrier wall, a first barrier wall, and a second barrier wall which are sequentially arranged from the display region to the opening region. The first barrier wall includes a first metal layer structure, at least one lateral surface of the first metal layer structure surrounding the opening region is provided with a notch; the first intercepting wall includes a first insulating layer structure; the second barrier wall includes a second metal layer structure and a first stacked structure, at least one lateral surface of the second metal layer structure surrounding the opening region is provided with a notch.

The present disclosure provides an OLED display panel, a preparation method thereof and an OLED display device. By providing an uneven surface on a side of a first encapsulation layer away from the organic light-emitting function layer in a non-display area, the uneven surface of the first encapsulation layer can block the flow of the second encapsulation layer to a certain extent, so as to reduce the fluidity and the climbing distance of the edge of the second encapsulation layer, and increase the edge stress and the slope angle. Thereby the narrow frame design of the product is achieved, the thickness uniformity of the edge of the second encapsulation layer is improved, the Mura defect in the non-display area is avoided, and the encapsulation result is guaranteed.

The display device includes a substrate, a transistor, a leveling film, a display element, a partition wall, and at least one dam. The substrate has a display region and a peripheral region surrounding the display region. The transistor is located over the display region. The leveling film is located over the display region and covers the transistor. The display element is located over the leveling film and includes a pixel electrode electrically connected to the transistor. The partition wall covers an edge portion of the pixel electrode. The at least one dam is located over the peripheral region, is spaced away from the leveling film, and surrounds the display region. The at least one dam has a base and stopper. The base includes a material included in at least one of the leveling film and the partition wall.

A light-emitting unit (140) is formed over a first surface (102) of a substrate (100). A first terminal (112) and a second terminal (132) are formed on the first surface (102) of the substrate (100), and are electrically connected to the light-emitting unit (140). A sealing layer (200) is formed over the first surface (102) of the substrate (100), and seals the light-emitting unit (140). In addition, the sealing layer (200) does not cover the first terminal (112) and the second terminal (132). A cover layer (210) is formed over the sealing layer (200), and is formed of a material different from that of the cover layer (210). In at least a portion of a region located next to the first terminal (112) and a region located next to the second terminal (132), a portion of an end of the cover layer (210) protrudes from the sealing layer (200).

An encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same are provided. The encapsulation film has excellent reliability that allows forming a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, absorbs and disperses the stress according to panel bending caused by CTE mismatch, and overcomes the performance decrease due to reliability degradation, while preventing generation of bright spots in the organic electronic device.