H10K50/842

Display panel comprising heat dissipation member and display apparatus including the same

The disclosure relates to display panel and display apparatus including the same. The display panel includes a substrate including a display part displaying an image, an adhesive layer covering the display part, on the substrate, and a heat dissipation member on the adhesive layer. The heat dissipation member includes a first metal layer, a middle layer including an organic layer and a plurality of partition walls provided on the first metal layer, and a second metal layer provided on the middle layer.

Substrate and preparation method thereof, display panel and preparation method thereof, and display device

A substrate and a preparation method thereof, a display panel and a preparation method thereof, and a display device are provided. The substrate includes a display region and a peripheral region positioned in a periphery of the display region and used for sealing, the substrate includes: a base substrate; an insulating layer, arranged on a side of the base substrate and positioned in the display region and the peripheral region for sealing; and a plurality of pixel units, positioned on the insulating layer corresponding to the display region, and in the peripheral region, at least one groove is disposed on a side of the insulating layer which faces away from the base substrate, a side of the groove which is away from the base substrate is open, and a depth direction of the groove is perpendicular to the base substrate.

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

DISPLAY DEVICE HAVING SHAPED SEALING MEMBER
20230259225 · 2023-08-17 ·

A display device includes a first substrate having a light-emitting element. A second substrate is disposed over the first substrate. A sealing member is disposed between the first substrate and the second substrate. The sealing member couples the first substrate and the second substrate together. The sealing member includes a first linear portion extending in a first direction, and a second linear portion extending in a second direction different from the first direction. A maximum width of the first linear portion is greater than a maximum width of the second linear portion.

DISPLAY APPARATUS WITH INTEGRATED TOUCH SCREEN
20230259224 · 2023-08-17 · ·

A display apparatus with an integrated touch screen is provided. The display apparatus includes: a light-emitting device layer on a first substrate, a first encapsulation layer on the light-emitting device layer, a touch sensing layer on the light-emitting device layer, and a second encapsulation layer on the touch sensing layer, the second encapsulation layer including at least one inorganic layer.

Organic light emitting diode display device

Discussed is an organic light emitting diode display device, including a display panel including an array substrate configured to display an image, a face sealing metal layer under the array substrate, and a protecting substrate under the face sealing metal layer, wherein the array substrate generates heat, and the generated heat is transferred from the array substrate to the protecting substrate via the face sealing metal layer to be radiated by the protecting substrate; and a printed circuit board under the protecting substrate, wherein an end portion of the array substrate, an end portion of the face sealing metal layer and an end portion of the protecting substrate form a stepped structure.

Electronic panel and electronic apparatus including the same

An electronic panel, includes: a base substrate including a front surface, a rear surface opposite the front surface, and a plurality of side surfaces connecting the front surface and the rear surface to each other; a pixel definition layer on the front surface of the base substrate and having a plurality of openings defined therein; a plurality of emitting elements in the openings; and a spacer on the pixel definition layer and spaced apart from the openings, wherein a thickness of the spacer is equal to or greater than a thickness of the pixel definition layer.

Display device with island-shape spacers in non-display area

A display device includes a first substrate, an insulating layer, a plurality of display elements, a plurality of first spacers, and a second substrate. The first substrate includes a transmission area, a display area surrounding at least a portion of the transmission area, and a first non-display area located between the transmission area and the display area. The insulating layer is arranged on the first substrate in the display area and the first non-display area. The plurality of display elements are disposed on the insulating layer in the display area. The plurality of first spacers each has an island shape and are spaced apart from each other on the insulating layer in the first non-display area. The second substrate faces the first substrate.

Light-Emitting Device And Electronic Device

A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.

PROFILING AND LAMINATING DEVICE, PROFILING AND LAMINATING METHOD, DISPLAY MODULE, AND DISPLAY DEVICE

A profiling and laminating device includes: a fixture, a carrier film, a first driving assembly and a second driving assembly. The fixture includes a first main surface, a curved transition surface and a second main surface that are connected in sequence, and the first main surface and the second main surface are located on two opposite sides of the fixture, respectively. A surface of the carrier film is used for carrying a flexible display panel, and another surface of the carrier film is used for covering at least the first main surface and the second main surface of the fixture. The first driving assembly is used for driving the fixture to move. The second driving assembly is used for driving the carrier film to move.