A display apparatus and a method of manufacturing the same are provided. According to an embodiment, a display apparatus includes: a substrate; a thin-film transistor located on the substrate; and a buffer layer, a conductive layer, and an insulating layer sequentially located from the substrate between the substrate and the thin-film transistor, and a thickness of the insulating layer is less than a thickness of the buffer layer.

A display device including: a substrate; an active layer, and including channel and conductive regions; a first conductive layer including a driving gate electrode and a scan line in a first direction; a second conductive layer including a storage line; a third conductive layer including a first connecting member above the storage line; an insulating layer between the storage line and the first connecting member; and a data line and a driving voltage line crossing the scan line in a second direction, wherein the first connecting member electrically connects the driving gate electrode and a conductive region, the driving voltage line overlaps the first connecting member, the insulating layer includes first and second sub-insulating layers, and an edge of the second sub-insulating layer substantially overlaps an edge of the first connecting member in a thickness direction of the display device.

A display panel and a method of fabricating the same are provided. The display panel includes: a base substrate; a first electrode disposed on the base substrate; a hole injection layer disposed on the first electrode, wherein a surface of the hole injection layer away from the first electrode is scattering surface. In the present invention, the surface of the hole injection layer away from the first electrode is set as the scattering surface, and changes of brightness and chromaticity caused by a change of viewing angles is weakened by the scattering surface, thereby expanding viewing angles of the display panel.

A display film includes a transparent glass layer having a thickness of 250 micrometers or less, or in a range from 25 to 100 micrometers. A transparent energy dissipation layer is fixed to the transparent glass layer. The transparent energy dissipation layer has a glass transition temperature of 27 degrees Celsius or less, a Tan Delta peak value of 0.5 or greater, or from 1 to 2 and a Young's Modulus (E′) greater than 0.9 MPa over a temperature range of −40 degrees Celsius to 70 degrees Celsius. In a preferred embodiment, the transparent energy dissipation layer comprises a cross-linked polyurethane layer or a cross-linked polyurethane acrylate layer.

Disclosed are a probe integrated with an organic light source and a manufacturing method thereof. An organic light source integration method includes forming a first thin film encapsulation layer on a probe shank, depositing a first electrode in a first region on the first thin film encapsulation layer, depositing an insulating layer in a second region on the first thin film encapsulation layer, depositing a light emitting layer on the first electrode and the insulating layer, depositing a second electrode on the light emitting layer, and forming a second thin film encapsulation layer on the second electrode.

A display panel and a display device are provided, and the display panel includes a bonding area, a thin film transistor functional layer, and a conductive structure layer disposed in order. A part of the thin film transistor functional layer disposed on the bonding area includes a first inorganic layer and a plurality of signal lines. The conductive structure layer includes a second inorganic layer and a conductive layer disposed in order, and a part of the second inorganic layer disposed in the bonding area is disposed on the signal line and is directly disposed on the first inorganic layer.

A mobile terminal according to an embodiment includes a display panel having flexibility, and a support plate configured to support the display panel and to include a curved edge, at least a part of which is surrounded by the display panel. The display panel includes a base substrate, a light-emitting layer provided on the base substrate and configured to include a light-emitting element, a thin-film encapsulation layer configured to seal the light-emitting element, and a thin-film transistor (TFT) film configured to supply a signal to the light-emitting element, a polarizing film provided on the light-emitting layer, and a protective film provided on the polarizing film. The TFT film is extended from the base substrate at the curved edge to cover an edge of the base substrate.

Implementations described herein generally relate to flexible display devices and cover lens assemblies with flexible cover lens. In one or more embodiments, a cover lens assembly is provided and includes a first flexible cover lens, a second flexible cover lens, and a sacrificial adhesion disposed between the first flexible cover lens and the second flexible cover lens. The first flexible cover lens includes a first hard coat layer having a hardness in a range from about 4H to about 9H and a first substrate. The second flexible cover lens includes a second hard coat layer having a hardness in a range from about 2H to about 9H. The first substrate is disposed between the first hard coat layer and the sacrificial adhesion layer.

Provided are a display panel and a display apparatus. The display panel includes a back panel, and a fingerprint identification unit, a specular reflection film layer and a touch unit which are disposed on the back panel, wherein the fingerprint identification unit includes a fingerprint identification electrode layer, the touch unit includes a touch electrode layer; and the fingerprint identification electrode layer, the specular reflection film layer and the touch electrode layer are disposed in a same layer.

This disclosure relates to the field of display technologies and, in particular to a thin film packaging structure and a display panel. A thin film packaging structure includes a first inorganic packaging layer for covering a device to be packaged; an organic packaging layer formed at a side of the first inorganic packaging layer; a second inorganic packaging layer formed at a side of the organic packaging layer facing away from the first inorganic packaging layer; and at least one first inorganic adjusting layer formed at a side of the first inorganic packaging layer facing away from the device to be packaged. The at least one first inorganic adjusting layer has an elasticity modulus greater than that of the first inorganic packaging layer or the second inorganic packaging layer.