The present invention provides a display panel packaging method and a packaging structure. The display panel packaging method includes: providing a first substrate and forming a water-blocking layer, dispensing a sealant on a second substrate, coating a polymeric adhesive material in a region surrounded by the sealant, coating a light-absorbing material on the polymeric adhesive material, bonding the two substrates and uniformly mixing the polymeric adhesive material and the light-absorbing material to form a uniformly mixed film, and curing them and finishing packaging. This display panel packaging is effective.

A display apparatus includes: a substrate including a display area and a peripheral area around the display area, a first organic layer arranged in the peripheral area, and a second organic layer arranged in the display area and the peripheral area. A tilt angle of a side surface of the second organic layer is equal to or greater than about 10 degrees and less than or equal to about 90 degrees.

A light emitting display device with an integrated touch screen includes: a substrate which includes a display area in which a plurality of display pixels is disposed and a non-display area around the display area; a light emitting diode in the display area; an encapsulation unit which covers the display area and the non-display area; a touch electrode line on the encapsulation unit; a touch routing line which is disposed in the non-display area and is connected to the touch electrode line; a plurality of blocking structures which is disposed in the non-display area and is configured to enclose the display area; and a step compensation layer disposed between the encapsulation unit and the touch routing line; wherein the step compensation layer reduces a step caused by the plurality of blocking structures to reduce irregularities of a surface of the encapsulation unit.

An organic light-emitting display device including an encapsulating layer covering a light-emitting element and an encapsulating substrate on the encapsulating layer is provided. The organic light-emitting display device may include metal particles which are dispersed on an outer surface of the encapsulating substrate having a high thermal conductivity, so that damage of the light-emitting element due to external impact may be prevented. And, the organic light-emitting display device may include a capping layer covering the metal particles, so that the surface roughness due to the metal particles may be reduced.

The present disclosure provides a display panel and a manufacturing method thereof. The display panel includes a substrate layer, a first block wall, a first inorganic layer, and an organic layer, wherein the substrate layer includes a display area and a non-display area; the first block wall is disposed in the non-display area of the substrate layer and surrounds the display area. a surface of the first block wall includes a hydrophobic layer; the first inorganic layer covers the substrate layer and exposes the first block wall; the organic layer is disposed on the first inorganic layer and located in the display area.

The present invention discloses an organic light-emitting display panel, a manufacturing method thereof, and an encapsulation film thereof. In this invention, an auxiliary encapsulation layer is disposed on an outer side of an inorganic layer, and the auxiliary encapsulation layer at least covers a bending region of the inorganic layer and a boundary region of the inorganic layer. Even if the inorganic layer cracks or peels in the bending region and the boundary region, a channel of water and oxygen generated at a cracked place or a peeling place is blocked by the auxiliary encapsulation layer, thereby ensuring an ability of the encapsulation film to block water and oxygen into an organic light-emitting device.

A sealed structure which has high sealing capability and whose border can be slim is provided. The sealed structure includes a pair of substrates whose respective surfaces face each other with a space therebetween, and a glass layer which is in contact with the substrates, defines a space between the substrates, and has at least one corner portion and side portions in continuity with the corner portion. The width of the corner portion of the glass layer is smaller than or equal to that of the side portion of the same. The sealed structure may comprise a highly reliable light-emitting element including a layer containing a light-emitting organic compound provided between a pair of electrodes.

Provided are an encapsulation structure, a production method thereof, a glue-spreading device, and an encapsulation glue. The encapsulation structure has an encapsulation glue layer, wherein the encapsulation glue layer has an adhesive layer formed from an adhesive glue and a desiccant composition core formed from a colloidal desiccant composition, wherein the adhesive layer fully envelops the desiccant composition core, wherein the colloidal desiccant composition has a colloidal desiccant-dispersing medium and a desiccant dispersed in the colloidal desiccant-dispersing medium.

An organic light emitting display is provided. The organic light emitting display includes a first base substrate; a plurality of organic light emitting diodes disposed on the first base substrate; an encapsulation layer disposed on the organic light emitting diodes; and a plurality of first color conversion filters disposed on the encapsulation layer. The encapsulation layer includes: a first sub-inorganic layer disposed on the organic light emitting diodes; a second sub-inorganic layer disposed on the first sub-inorganic layer and having a refractive index different from that of the first sub-inorganic layer; an organic layer disposed on the second sub-inorganic layer; and a third sub-inorganic layer disposed on the organic layer.

Provided are an OLED display panel and a manufacturing method thereof. The OLED display panel includes an array substrate, pixel electrodes disposed on the array substrate, a retaining wall disposed on the array substrate and a luminescent material layer disposed on the pixel electrodes; wherein the retaining wall includes openings corresponding to the pixel electrodes in one-to-one correspondence, and the retaining wall includes a plurality of first split bodies and a plurality of second split bodies which are criss-crossed, and a groove is disposed on one side of the first split body and on one side of the second split body away from the array substrate.